Flip Chip Technologies, L.l.c.

Calculating rank

USPTO Granted Patents = 5

% Expired Patents = 20.0

EPO Patents = 1

Forward Citations = 342

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5 inventors (with patents filed for the assignee):

Peter Elenius (4 out of 10 patents)

Harry Hollack (3 out of 3 patents)

Jamin Ling (1 out of 3 patents)

4. Deok-Hoon Kim (1 out of 1 patent)

5. Dave Charles Stepniak (1 out of 1 patent)

6. Michael E Johnson (6 patents)

5 patents: Sort by Forward Citations

1. 6750135 - Method for forming chip scale package (2004-06-15),

2. 6578755 - Polymer collar for solder bumps (2003-06-17),

3. 6445069 - Electroless Ni/Pd/Au metallization structure for copper interconnect substrate and method therefor (2002-09-03),

4. 6441487 - Chip scale package using large ductile solder balls (2002-08-27),

5. 6287893 - Method for forming chip scale package (2001-09-11),

Company Overview

Flip Chip Technologies, L.l.c. is a leading provider of advanced semiconductor packaging solutions. With over 20 years of experience, our innovative technologies enable high-performance, high-density integrated circuits for a wide range of applications. We specialize in flip chip interconnects, wafer bumping, and advanced assembly services to meet the demanding requirements of the semiconductor industry.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

5 Patents

#176 in Phoenix, AZ

#694 in Arizona

#51,669 in US

Phoenix, AZ, United States of America

Flip Chip Technologies, L.l.c.

Forward Citations = 342

5 inventors:

Peter Elenius (4 out of 10 patents)

Harry Hollack (3 out of 3 patents)

Jamin Ling (1 out of 3 patents)

4. Deok-Hoon Kim (1 out of 1 patent)

5. Dave Charles Stepniak (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Flip Chip Technologies, L.l.c.. Retrieved from https://idiyas.com/company/flip-chip-technologies

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent (EPO):

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]