Phoenix, AZ, United States of America

Deok-Hoon Kim

This inventor holds 1 USPTO granted patent. Top assignee: Flip Chip Technologies, L.l.c.. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Deok-Hoon Kim. Retrieved from https://idiyas.com/inventor/deok-hoon-kim-29gnlxuy

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 42(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Deok-Hoon Kim

Introduction

Deok-Hoon Kim is a notable inventor based in Phoenix, AZ, who has made significant contributions to the field of electronics through his innovative work. He is currently associated with Flip Chip Technologies, L.L.C., where he focuses on advancing soldering techniques in integrated circuits.

Latest Patents

One of Kim's key patents is titled "Polymer collar for solder bumps." This invention describes a method of forming a polymer support ring, or collar, around the base of solder balls used to create solder joints. The process involves forming patterned regions of uncured polymer material over each conductive solder bump pad on an integrated circuit package or other substrate. The uncured polymer material is preferably a no-flow underfill material that fluxes the solder bump pads. Pre-formed solder balls are then placed into the uncured polymer material onto their respective solder bump pads. A subsequent heating cycle raises the assembly to the reflow temperature of the solder balls, thereby attaching the solder balls to the underlying solder bump pads. This process also partially cures the polymer material to form a support collar at the base region of each attached solder ball. Kim holds 1 patent for this innovative technology.

Career Highlights

Throughout his career, Deok-Hoon Kim has demonstrated a commitment to enhancing the reliability and efficiency of soldering processes in electronic devices. His work has been instrumental in improving the performance of integrated circuits, which are critical components in modern technology.

Collaborations

Kim collaborates with various professionals in his field, including his coworker Peter Elenius, to further develop and refine his inventions. Their combined expertise contributes to the innovative environment at Flip Chip Technologies.

Conclusion

Deok-Hoon Kim's contributions to the field of electronics, particularly through his patent for a polymer collar for solder bumps, highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for advancements in soldering technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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