Harry Hollack

Title: **Innovative Contributions of Harry Hollack in Chip Scale Packaging**

Introduction

Harry Hollack, a notable inventor based in Scottsdale, AZ, has made significant strides in the field of semiconductor technologies. With a total of three patents to his name, Hollack focuses on advanced chip scale packaging methodologies that enhance the design and functionality of integrated circuits.

Latest Patents

Hollack's latest patents showcase his innovative approach to chip scale packaging. One of his prominent patents outlines a **Method for Forming Chip Scale Package**. This design involves a redistribution metal layer on the upper surface of a semiconductor wafer, enabling the simultaneous formation of solder bump pads and metal redistribution traces. These features electrically couple the solder bump pads with the conductive bond pads, facilitating improved connectivity within the integrated circuit. Additionally, a patterned passivation layer is applied over the metal layer, while large, ductile solder balls are utilized for mounting, eliminating the need for underfill materials.

Another important contribution from Hollack is the patent on **Chip Scale Package Using Large Ductile Solder Balls**. This patent reiterates the methodology involving a redistribution metal layer, similar to his earlier work. The significant aspect of this patent is the use of larger solder balls that enhance the mechanical durability of the connection, ensuring a reliable interface with circuit boards.

Career Highlights

Hollack's career has been closely associated with Flip Chip Technologies, L.L.C., where he continues to innovate within the semiconductor packaging sector. His expertise and development of groundbreaking patent technologies have established him as a key figure in his field. His contributions not only reflect his technical skills but also his ability to address industry needs and challenges effectively.

Collaborations

At Flip Chip Technologies, Hollack collaborates with various professionals, including his coworker, Peter Elenius. This collaboration fosters a dynamic environment where inventive ideas can flourish, leading to advanced solutions in chip packaging technologies.

Conclusion

In summary, Harry Hollack's inventive prowess in chip scale packaging stands out in the semiconductor industry. His patents reflect a deep understanding of integrated circuits, while his collaboration with skilled colleagues enhances innovation within Flip Chip Technologies. Hollack's contributions are vital to advancing technologies that form the backbone of modern electronics.