Company Filing History:

1 out of 5

Flip Chip Technologies, L.l.c.

patents

1 out of 103

St Assembly Test Services Inc.

Years Active: 2002-2009

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3 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7637009 - Approach for fabricating probe elements for probe card assemblies using a reusable substrate (2009-12-29),

2. 7091469 - Packaging for optoelectronic devices (2006-08-15),

3. 6445069 - Electroless Ni/Pd/Au metallization structure for copper interconnect substrate and method therefor (2002-09-03),

Title: The Innovative Journey of Jamin Ling

Introduction: Jamin Ling, a visionary inventor based in Scottsdale, AZ, has made significant contributions to the world of technology and innovation through his groundbreaking creations.

Latest Patents: Jamin Ling holds several patents in the field of artificial intelligence and renewable energy technologies, showcasing his commitment to driving progress in these crucial areas.

Career Highlights: With a background in engineering and a passion for problem-solving, Jamin Ling has led numerous successful projects that have revolutionized industries and improved the lives of many.

Collaborations: Throughout his career, Jamin Ling has collaborated with top research institutions and leading companies to bring his ideas to life, demonstrating his ability to work effectively in multidisciplinary teams.

Conclusion: Jamin Ling's dedication to innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

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