The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2006
Filed:
May. 19, 2000
Peter Elenius, Scottsdale, AZ (US);
Hong Yang, San Diego, CA (US);
Peter Elenius, Scottsdale, AZ (US);
Hong Yang, San Diego, CA (US);
FlipChip International, LLC, Phoenix, AZ (US);
Abstract
A solder bar compatible with conventional flip chip technology fabrication methods for high power/high current applications includes first and second generally circular solder pads of diameter D formed upon a substrate and connected by a solder bar pad of width BW. The centers of the generally circular solder pads are spaced apart by distance BL (bar length). A mass of solder having volume VB is formed over the first and second generally circular solder pads and over the solder bar pad to form a dog-bone shaped solder bar. The solder bar reaches height Habove the centers of the first and second generally circular solder pads, and reaching height Habove the midpoint of the solder bar pad. The values for diameter D, bar length BL, bar width BW, and solder volume VB are selected in such manner that Hand Hare approximately equal. Conventional circular (as viewed from above) solder bumps can be formed upon the same substrate; in this case, heights Hand Hare made approximately equal to the height of the conventional solder bumps.