Ze'ev Wurman

USPTO Granted Patents = 16 (Patent Applications = 1)

CIPO Patents = 1

EPO Patents = 1 (Patent Applications = 2)

Average Co-Inventor Count = 3.3

ph-index = 12

Forward Citations = 1,863(Granted Patents)

Company Filing History:

Years Active: 2001-2017

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16 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9577642 - Method to form a 3D semiconductor device (2017-02-21),

2. 9219005 - Semiconductor system and device (2015-12-22),

3. 9136153 - 3D semiconductor device and structure with back-bias (2015-09-15),

4. 9029173 - Method for fabrication of a semiconductor device and structure (2015-05-12),

5. 8642416 - Method of forming three dimensional integrated circuit devices using layer transfer technique (2014-02-04),

6. 8492886 - 3D integrated circuit with logic (2013-07-23),

7. 8378715 - Method to construct systems (2013-02-19),

8. 8362800 - 3D semiconductor device including field repairable logics (2013-01-29),

9. 8273610 - Method of constructing a semiconductor device and structure (2012-09-25),

10. 8258810 - 3D semiconductor device (2012-09-04),

11. 7550996 - Structured integrated circuit device (2009-06-23),

12. 7514959 - Structured integrated circuit device (2009-04-07),

13. 7463062 - Structured integrated circuit device (2008-12-09),

14. 7098691 - Structured integrated circuit device (2006-08-29),

15. 6642744 - Customizable and programmable cell array (2003-11-04),

Title: Ze'ev Wurman: Innovator in 3D Semiconductor Technology

Introduction

Ze'ev Wurman is a prominent inventor based in Palo Alto, CA, known for his significant contributions to the field of semiconductor technology. With a total of 16 patents to his name, Wurman has been at the forefront of innovations that enhance the capabilities of integrated circuits.

Latest Patents

Wurman's latest patents include a method to form a 3D semiconductor device. This method involves fabricating two or more devices and connecting them to create a 3D integrated circuit. Notably, at least one of the devices features an unused designated dice line, and at least one is a configurable device. The interconnection of these devices is achieved using Through Silicon Vias. Another significant patent is for a 3D IC-based mobile system, which includes a first semiconductor layer with mono-crystallized transistors interconnected by a metal layer. This innovative design also features a second layer of mono-crystallized transistors and a heat removal apparatus, ensuring efficient thermal management.

Career Highlights

Throughout his career, Wurman has worked with several notable companies, including Monolithic 3D Inc. and Easic Corporation. His work has significantly impacted the development of advanced semiconductor technologies, making him a key figure in the industry.

Collaborations

Wurman has collaborated with esteemed professionals in the field, including Zvi Or-Bach and Deepak Chandra Sekar. These collaborations have further enriched his contributions to semiconductor innovations.

Conclusion

Ze'ev Wurman's work in 3D semiconductor technology exemplifies his commitment to advancing the field. His innovative patents and collaborations highlight his role as a leading inventor in the industry.

This text is generated by artificial intelligence and may not be accurate.