The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Aug. 24, 2012
Zvi Or-bach, San Jose, CA (US);
Ze'ev Wurman, Palo Alto, CA (US);
Zvi Or-Bach, San Jose, CA (US);
Ze'ev Wurman, Palo Alto, CA (US);
Monolithic 3D Inc., San Jose, CA (US);
Abstract
A method to construct first and second configurable systems including: providing a first configurable system including a first die and a second die, where the first die is diced from a first wafer and the second die is diced from a second wafer and the first die is connected to the second die using at least one through-silicon-via (TSV); providing a second configurable system including a third die and a fourth die, where the third die is diced from a third wafer and the fourth die is diced from a fourth wafer and the third die is connected to the fourth die using at least one through-silicon-via (TSV); where processing the first wafer and the third wafer utilizes a majority of masks that are substantially same; and where the first die is larger than the third die.