For the Inventor, By the Inventor

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Klamath Falls, OR, United States of America

Monolithic 3d Inc.

USPTO Granted Patents = 396

Forward Citations = 3,098

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14 inventors (with patents filed for the assignee):

Zvi Or-Bach (396 out of 517 patents)

Brian Cronquist (256 out of 275 patents)

Deepak Chandra Sekar (210 out of 285 patents)

4. Jin-Woo Han (69 out of 144 patents)

5. Zeev Wurman (39 out of 41 patents)

6. Israel Beinglass (28 out of 56 patents)

7. Jan Lodewijk De Jong (21 out of 42 patents)

8. Eli Lusky (20 out of 20 patents)

9. Ze'ev Wurman (10 out of 16 patents)

10. Paul G Lim (9 out of 12 patents)

11. Yuniarto Widjaja (5 out of 247 patents)

12. Isreal Beinglass (3 out of 3 patents)

13. J L De Jong (2 out of 2 patents)

14. Albert Karl Henning (1 out of 10 patents)

Core Competencies:

3D Integrated Circuits

3D Semiconductor Devices

Memory Arrays

Metal Layers

Transistors

Power Distribution Grids

Logic Circuits

Wafer Bonding

Electronic Circuit Units

Memory Cells

Multilayer Semiconductor Structures

Single-Crystal Layers

396 patents: Sort by Forward Citations

1. 12477752 - 3D semiconductor memory devices and structures (2025-11-18),

2. 12476168 - 3D semiconductor device and structure with three levels and isolation layers (2025-11-18),

3. 12475952 - 3D semiconductor devices and structures with slits (2025-11-18),

4. 12475294 - Automation methods for 3D integrated circuits and devices (2025-11-18),

5. 12469735 - 3D semiconductor device and structure with metal layers and memory cells (2025-11-11),

6. 12464734 - Method for producing 3D semiconductor devices and structures with transistors and memory cells (2025-11-04),

7. 12463076 - 3D semiconductor device and structure (2025-11-04),

8. 12433031 - 3D semiconductor devices and structures with electronic circuit units (2025-09-30),

9. 12432926 - Method to produce a 3D multilayer semiconductor device and structure (2025-09-30),

10. 12402330 - 3D memory devices and structures with memory arrays and metal layers (2025-08-26),

11. 12400961 - 3D semiconductor device and structure with metal layers (2025-08-26),

12. 12396284 - Multilevel semiconductor device and structure with image sensors and wafer bonding (2025-08-19),

13. 12389602 - 3D semiconductor device and structure with logic and memory (2025-08-12),

14. 12376382 - 3D semiconductor devices and structures with metal layers (2025-07-29),

15. 12369347 - 3D semiconductor device and structure with metal layers and a power delivery path (2025-07-22),

Monolithic 3D Inc. is a revolutionary company specializing in 3D printing technology. With our innovative approach, we strive to advance the capabilities of 3D printers by developing cutting-edge monolithic designs. Our unique process allows for the production of highly complex structures with enhanced durability and performance. By eliminating the need for assembly and reducing material waste, we aim to make 3D printing more efficient and cost-effective for various industries. Join us in shaping the future of manufacturing.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

396 Patents

#1 in

#1,133 in

#2,269 in the World

Klamath Falls, OR, United States of America

Monolithic 3d Inc.

Forward Citations = 3,098

14 inventors:

Zvi Or-Bach (396 out of 517 patents)

Brian Cronquist (256 out of 275 patents)

Deepak Chandra Sekar (210 out of 285 patents)

4. Jin-Woo Han (69 out of 144 patents)

5. Zeev Wurman (39 out of 41 patents)

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