For the Inventor, By the Inventor

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Klamath Falls, OR, United States of America

Monolithic 3D Inc.

USPTO Granted Patents = 410

% Expired Patents = 15.4

Forward Citations = 3,340

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15 inventors (with patents filed for the assignee):

Zvi Or-Bach (396 out of 517 patents)

Brian Cronquist (264 out of 285 patents)

Deepak Chandra Sekar (212 out of 287 patents)

4. Jin-Woo Han (79 out of 155 patents)

5. Zeev Wurman (39 out of 41 patents)

6. Israel Beinglass (28 out of 56 patents)

7. Eli Lusky (22 out of 22 patents)

8. Jan Lodewijk De Jong (21 out of 42 patents)

9. Zvi Or-Bach (14 out of 14 patents)

10. Ze'ev Wurman (10 out of 16 patents)

11. Paul G Lim (9 out of 12 patents)

12. Yuniarto Widjaja (5 out of 250 patents)

13. Isreal Beinglass (3 out of 3 patents)

14. J L De Jong (2 out of 2 patents)

15. Albert Karl Henning (1 out of 10 patents)

Core Competencies:

3D Semiconductor

Memory Cells

Metal Layers

Logic Circuits

Integration

Transistors

Memory Arrays

Power Delivery

Electronic Circuit Units

Wafer Bonding

Multilevel Structures

Automation Methods

410 patents: Sort by Forward Citations

1. 12684778 - 3D memory semiconductor devices and structures with memory cells (2026-07-14),

2. 12666619 - 3D semiconductor devices and structures with logic and memory, and a semiconductor die (2026-06-23),

3. 12653021 - Methods for fabricating 3D memory devices and structures with memory arrays and metal layers (2026-06-09),

4. 12648143 - 3D semiconductor device and structure with logic and memory (2026-06-02),

5. 12635163 - Method to produce a 3D multilayer semiconductor device and structure (2026-05-19),

6. 12628430 - 3D semiconductor device and structure including power distribution grids (2026-05-12),

7. 12622014 - 3D semiconductor device and structure with metal layers and a power delivery path (2026-05-05),

8. 12622001 - 3D semiconductor device, structure and methods with memory arrays and connectivity structures (2026-05-05),

9. 12616073 - 3D semiconductor device and structure with metal layers (2026-04-28),

10. 12615784 - 3D semiconductor memory device and structure (2026-04-28),

11. 12610563 - 3D semiconductor devices and structures with functional units and pillars (2026-04-21),

12. 12564006 - 3D semiconductor device and structure with memory cells and multiple metal layers (2026-02-24),

13. 12563752 - 3D semiconductor devices and structures with electronic circuit units (2026-02-24),

14. 12501630 - 3D semiconductor device and structure with logic circuits, memory cells, and processor array (2025-12-16),

15. 12477752 - 3D semiconductor memory devices and structures (2025-11-18),

Monolithic 3D Inc. is a revolutionary company specializing in 3D printing technology. With our innovative approach, we strive to advance the capabilities of 3D printers by developing cutting-edge monolithic designs. Our unique process allows for the production of highly complex structures with enhanced durability and performance. By eliminating the need for assembly and reducing material waste, we aim to make 3D printing more efficient and cost-effective for various industries. Join us in shaping the future of manufacturing.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 15 2026

Monolithic 3D Inc.

410 Patents

#1 in

#1,142 in

#2,279 in the World

Klamath Falls, OR, United States of America

Monolithic 3D Inc.

Forward Citations = 3,340

15 inventors:

Zvi Or-Bach (396 out of 517 patents)

Brian Cronquist (264 out of 285 patents)

Deepak Chandra Sekar (212 out of 287 patents)

4. Jin-Woo Han (79 out of 155 patents)

5. Zeev Wurman (39 out of 41 patents)

Please report any incorrect information to [email protected]

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