The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Aug. 08, 2024
Applicant:

Monolithic 3d Inc., Klamath Falls, OR (US);

Inventors:

Zvi Or-Bach, Haifa, IL;

Brian Cronquist, Klamath Falls, OR (US);

Deepak C. Sekar, Sunnyvale, CA (US);

Assignee:

Monolithic 3D Inc., Allen, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); G11C 8/16 (2006.01); H01L 21/683 (2006.01); H01L 21/74 (2006.01); H01L 21/762 (2006.01); H01L 21/768 (2006.01); H01L 23/525 (2006.01); H10B 10/00 (2023.01); H10B 12/00 (2023.01); H10B 20/00 (2023.01); H10B 20/25 (2023.01); H10B 41/20 (2023.01); H10B 41/40 (2023.01); H10B 41/41 (2023.01); H10B 43/20 (2023.01); H10B 43/40 (2023.01); H10D 10/01 (2025.01); H10D 30/01 (2025.01); H10D 30/60 (2025.01); H10D 30/68 (2025.01); H10D 30/69 (2025.01); H10D 64/01 (2025.01); H10D 64/27 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 84/85 (2025.01); H10D 84/90 (2025.01); H10D 86/00 (2025.01); H10D 86/01 (2025.01); H10D 88/00 (2025.01); H10D 89/10 (2025.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); G11C 8/16 (2013.01); H01L 21/743 (2013.01); H01L 21/76254 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/5252 (2013.01); H10B 10/00 (2023.02); H10B 10/125 (2023.02); H10B 12/053 (2023.02); H10B 12/09 (2023.02); H10B 12/20 (2023.02); H10B 12/50 (2023.02); H10B 20/00 (2023.02); H10B 20/25 (2023.02); H10B 41/20 (2023.02); H10B 41/40 (2023.02); H10B 41/41 (2023.02); H10B 43/20 (2023.02); H10B 43/40 (2023.02); H10D 10/051 (2025.01); H10D 30/0411 (2025.01); H10D 30/0413 (2025.01); H10D 30/0512 (2025.01); H10D 30/60 (2025.01); H10D 30/681 (2025.01); H10D 30/69 (2025.01); H10D 30/711 (2025.01); H10D 30/792 (2025.01); H10D 64/027 (2025.01); H10D 64/513 (2025.01); H10D 84/0172 (2025.01); H10D 84/038 (2025.01); H10D 84/85 (2025.01); H10D 84/907 (2025.01); H10D 84/998 (2025.01); H10D 86/01 (2025.01); H10D 86/201 (2025.01); H10D 88/00 (2025.01); H10D 88/01 (2025.01); H10D 89/10 (2025.01); H01L 23/3677 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2221/68368 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/83894 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/01002 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01018 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01066 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12033 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H10B 12/05 (2023.02); H10D 86/0214 (2025.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01);
Abstract

A 3D semiconductor device including: a first level including a first single crystal layer and first transistors, which each include a single crystal channel; a first metal layer with an overlaying second metal layer; a second level including second transistors, overlaying the first level; a third level including third transistors, overlaying the second level; a fourth level including fourth transistors, overlaying the third level, where the second level includes first memory cells, where each of the first memory cells includes at least one of the second transistors, where the fourth level includes second memory cells, where each of the second memory cells includes at least one of the fourth transistors, where the first level includes memory control circuits, where second memory cells include at least four memory arrays, each of the four memory arrays are independently controlled, and at least one of the second transistors includes a metal gate.


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