The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2015

Filed:

Sep. 20, 2012
Applicant:

Monolithic 3d Inc., San Jose, CA (US);

Inventors:

Zvi Or-Bach, San Jose, CA (US);

Deepak Sekar, San Jose, CA (US);

Brian Cronquist, San Jose, CA (US);

Ze'ev Wurman, Palo Alto, CA (US);

Assignee:

MONOLITHIC 3D INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/762 (2006.01); H01L 23/544 (2006.01); H01L 21/683 (2006.01); H01L 27/06 (2006.01); H01L 27/092 (2006.01); B82Y 10/00 (2011.01); H01L 21/84 (2006.01); H01L 29/66 (2006.01); H01L 27/02 (2006.01); H01L 29/78 (2006.01); H01L 27/105 (2006.01); H01L 27/108 (2006.01); H01L 29/788 (2006.01); H01L 29/792 (2006.01); H01L 27/11 (2006.01); H01L 27/115 (2006.01); H01L 27/118 (2006.01); H01L 27/12 (2006.01); G11C 16/04 (2006.01); G11C 16/10 (2006.01); H01L 29/786 (2006.01); H01L 29/10 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 27/088 (2006.01); G11C 11/41 (2006.01); G11C 17/18 (2006.01); G11C 29/32 (2006.01); G11C 29/44 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76254 (2013.01); B82Y 10/00 (2013.01); G11C 16/0408 (2013.01); G11C 16/0483 (2013.01); G11C 16/10 (2013.01); H01L 21/6835 (2013.01); H01L 21/84 (2013.01); H01L 23/544 (2013.01); H01L 27/0207 (2013.01); H01L 27/0688 (2013.01); H01L 27/0694 (2013.01); H01L 27/092 (2013.01); H01L 27/1052 (2013.01); H01L 27/10802 (2013.01); H01L 27/10894 (2013.01); H01L 27/10897 (2013.01); H01L 27/1104 (2013.01); H01L 27/1108 (2013.01); H01L 27/1116 (2013.01); H01L 27/1157 (2013.01); H01L 27/11524 (2013.01); H01L 27/11526 (2013.01); H01L 27/11529 (2013.01); H01L 27/11551 (2013.01); H01L 27/11573 (2013.01); H01L 27/11578 (2013.01); H01L 27/11807 (2013.01); H01L 27/1203 (2013.01); H01L 29/1033 (2013.01); H01L 29/66825 (2013.01); H01L 29/66833 (2013.01); H01L 29/785 (2013.01); H01L 29/7841 (2013.01); H01L 29/7881 (2013.01); H01L 29/78696 (2013.01); H01L 29/792 (2013.01); G11C 11/41 (2013.01); G11C 17/18 (2013.01); G11C 29/32 (2013.01); G11C 29/44 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 25/0655 (2013.01); H01L 27/088 (2013.01); H01L 29/66795 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54453 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81001 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A 3D IC based mobile system including: a first semiconductor layer including first mono-crystallized transistors, where the first mono-crystallized transistors are interconnected by at least one metal layer including aluminum or copper; a second layer including second mono-crystallized transistors and overlaying the at least one metal layer, where the at least one metal layer is in-between the first semiconductor layer and the second layer; a plurality of thermal paths between the second mono-crystallized transistors and a heat removal apparatus, where at least one of the plurality of thermal paths includes a thermal contact adapted to conduct heat and not conduct electricity; and a heat spreader layer between the second layer and the at least one metal layer.


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