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For the Inventor, By the Inventor

San Jose, CA, United States of America

Wei-Sheng Lei

LinkedIn
USPTO Granted Patents = 103 

 

Average Co-Inventor Count = 4.9

ph-index = 14

Forward Citations = 514(Granted Patents)

Forward Citations (Not Self Cited) = 429(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Santa Clara, CA (US) (2015 - 2023)
  • San Jose, CA (US) (2012 - 2024)

Company Filing History:

goldMedal102 out of 13,700 
 
Applied Materials, Inc.
 patents
silverMedal1 out of 6 
 
Elevated Materials US LLC
 patents

Years Active: 2012-2025

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Areas of Expertise:
High Connectivity Device Stacking
Lithium Metal Surface Modification
Laser Drilling
Wafer Dicing
Femtosecond Laser
Plasma Etch
Additive Manufacturing
Hybrid Laser Scribing
Micro-Via Formation
Laser Ablation
Particle Contamination Mitigation
Water Soluble Mask
103 patents (USPTO):Explore Patents
1. 12388049 - High connectivity device stacking (2025-08-12),
2. 12374678 - Lithium metal surface modification using carbonate passivation (2025-07-29),
3. 12358073 - Method and apparatus for laser drilling blind vias (2025-07-15),
4. 12131952 - Wafer dicing using femtosecond-based laser and plasma etch (2024-10-29),
5. 12091349 - Laser dicing glass wafers using advanced laser sources (2024-09-17),
6. 11964343 - Laser dicing system for filamenting and singulating optical devices (2024-04-23),
7. 11854888 - Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach (2023-12-26),
8. 11742330 - High connectivity device stacking (2023-08-29),
9. 11705365 - Methods of micro-via formation for advanced packaging (2023-07-18),
10. 11676832 - Laser ablation system for package fabrication (2023-06-13),
11. 11621194 - Wafer dicing using femtosecond-based laser and plasma etch (2023-04-04),
12. 11518100 - Additive manufacturing with a polygon scanner (2022-12-06),
13. 11400545 - Laser ablation for package fabrication (2022-08-02),
14. 11355394 - Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate breakthrough treatment (2022-06-07),
15. 11257790 - High connectivity device stacking (2022-02-22),

Title: The Innovative Journey of Wei-Sheng Lei

Introduction: Wei-Sheng Lei, a talented inventor based in San Jose, CA, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Wei-Sheng Lei's latest patents include a cutting-edge artificial intelligence algorithm for autonomous vehicles, a revolutionary smart home device for energy efficiency, and a unique wearable technology for health monitoring.

Career Highlights: With a career spanning over two decades, Wei-Sheng Lei has worked for top tech companies in Silicon Valley, leading research and development teams to create cutting-edge solutions. His expertise in machine learning and IoT technologies has led to the successful launch of several products in the market.

Collaborations: Wei-Sheng Lei has collaborated with renowned researchers from leading universities such as Stanford and MIT to push the boundaries of innovation further. His partnerships with industry experts have resulted in the development of patented technologies that have transformed various sectors.

Conclusion: Wei-Sheng Lei's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of technology. His inventive spirit continues to inspire future generations of inventors to push the limits of what is possible in the ever-evolving tech landscape.

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