The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Jun. 09, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Wei-Sheng Lei, San Jose, CA (US);

Mahendran Chidambaram, Saratoga, CA (US);

Kangkang Wang, San Jose, CA (US);

Ludovic Godet, Sunnyvale, CA (US);

Visweswaren Sivaramakrishnan, Cupertino, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/38 (2014.01); B23K 26/00 (2014.01); B23K 26/0622 (2014.01); B23K 26/08 (2014.01); B23K 26/55 (2014.01); C03B 33/02 (2006.01); C03B 33/10 (2006.01); C03C 23/00 (2006.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
C03B 33/0222 (2013.01); B23K 26/0006 (2013.01); B23K 26/0624 (2015.10); B23K 26/0861 (2013.01); B23K 26/55 (2015.10); C03B 33/102 (2013.01); C03C 23/0025 (2013.01); B23K 2101/40 (2018.08); B23K 2103/42 (2018.08); B23K 2103/50 (2018.08); B23K 2103/54 (2018.08); B23K 2103/56 (2018.08); B29C 2791/009 (2013.01);
Abstract

A method and apparatus for substrate dicing are described. The method includes utilizing a laser to dice a substrate along a dicing path to form a perforated line around each device within the substrate. The dicing path is created by exposing the substrate to bursts of laser pulses at different locations around each device. The laser pulses are delivered to the substrate and may have a pulse repetition frequency of greater than about 25 MHz, a pulse width of less than about 15 picoseconds, and a laser wavelength of about 1.0 μm to about 5 μm.


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