logo

For the Inventor, By the Inventor

San Rafael, CA, United States of America

James S Papanu

This inventor holds 64 USPTO granted patents and 10 published patent applications and 2 EPO patents, primarily in Hybrid Wafer Dicing (CPC class H01L). Top assignee: Applied Materials, Inc.. Active years: 1996-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: James S Papanu. Retrieved from https://idiyas.com/inventor/james-s-papanu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 64 

% Patents Active = 76.6

 

Average Co-Inventor Count = 4.9

ph-index = 14

Forward Citations = 1,541(Granted Patents)

Forward Citations (Not Self Cited) = 1,502(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal64 out of 14,433 
 
Applied Materials, Inc.
 patents

Years Active: 1996-2025

Loading Chart...
Loading Chart...
Areas of Expertise:
Hybrid Wafer Dicing
Laser Scribing
Plasma Etch
Water Soluble Masks
Etch Mask
Wafer Coating
Dicing Processes
Maskless Dicing
Die Singulation
Adaptive Optics
Solder Bumps
Vacuum Lamination
64 patents (USPTO):Explore Patents
1. 12469683 - Water vapor plasma to enhance surface hydrophilicity (2025-11-11),
2. 11901232 - Automatic kerf offset mapping and correction system for laser dicing (2024-02-13),
3. 11854888 - Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach (2023-12-26),
4. 11764061 - Water soluble organic-inorganic hybrid mask formulations and their applications (2023-09-19),
5. 11600492 - Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation process (2023-03-07),
6. 11217536 - Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process (2022-01-04),
7. 11211247 - Water soluble organic-inorganic hybrid mask formulations and their applications (2021-12-28),
8. 11158540 - Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process (2021-10-26),
9. 11011424 - Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process (2021-05-18),
10. 10903121 - Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process (2021-01-26),
11. 10535561 - Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process (2020-01-14),
12. 9972575 - Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process (2018-05-15),
13. 9852997 - Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process (2017-12-26),
14. 9793132 - Etch mask for hybrid laser scribing and plasma etch wafer singulation process (2017-10-17),
15. 9768014 - Wafer coating (2017-09-19),

Title: The Inventive Journey of James S Papanu

Introduction: James S Papanu, a talented inventor based in San Rafael, CA, has made significant contributions to the field of technology with his innovative creations.

Latest Patents: James S Papanu holds several patents in various technological domains, showcasing his versatility and creativity in inventing new solutions to complex problems.

Career Highlights: With a career spanning over two decades, James S Papanu has worked tirelessly to bring his ideas to life through the patenting process, solidifying his reputation as a forward-thinker in the industry.

Collaborations: Throughout his career, James S Papanu has collaborated with leading tech companies, research institutions, and universities to further develop and refine his inventions, demonstrating his commitment to pushing the boundaries of innovation.

Conclusion: James S Papanu's passion for innovation and his dedication to creating groundbreaking technologies have established him as a prominent figure in the world of inventors, with his work continuing to inspire future generations of innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…