logo

For the Inventor, By the Inventor

San Rafael, CA, United States of America

James S Papanu

USPTO Granted Patents = 64 

 

Average Co-Inventor Count = 4.9

ph-index = 14

Forward Citations = 1,528(Granted Patents)

Forward Citations (Not Self Cited) = 1,502(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal64 out of 13,713 
 
Applied Materials, Inc.
 patents

Years Active: 1996-2025

Loading Chart...
Loading Chart...
Areas of Expertise:
Water Vapor Plasma
Laser Dicing
Hybrid Laser Scribing
Plasma Etching
Wafer Singulation
Organic-Inorganic Hybrid Masks
Dicing Processes
Wafer Coating
Mask Formation
Electrostatic Chuck
Thin Wafer Dicing
Die Singulation
64 patents (USPTO):Explore Patents
1. 12469683 - Water vapor plasma to enhance surface hydrophilicity (2025-11-11),
2. 11901232 - Automatic kerf offset mapping and correction system for laser dicing (2024-02-13),
3. 11854888 - Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach (2023-12-26),
4. 11764061 - Water soluble organic-inorganic hybrid mask formulations and their applications (2023-09-19),
5. 11600492 - Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation process (2023-03-07),
6. 11217536 - Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process (2022-01-04),
7. 11211247 - Water soluble organic-inorganic hybrid mask formulations and their applications (2021-12-28),
8. 11158540 - Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process (2021-10-26),
9. 11011424 - Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process (2021-05-18),
10. 10903121 - Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process (2021-01-26),
11. 10535561 - Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process (2020-01-14),
12. 9972575 - Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process (2018-05-15),
13. 9852997 - Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process (2017-12-26),
14. 9793132 - Etch mask for hybrid laser scribing and plasma etch wafer singulation process (2017-10-17),
15. 9768014 - Wafer coating (2017-09-19),

Title: The Inventive Journey of James S Papanu

Introduction: James S Papanu, a talented inventor based in San Rafael, CA, has made significant contributions to the field of technology with his innovative creations.

Latest Patents: James S Papanu holds several patents in various technological domains, showcasing his versatility and creativity in inventing new solutions to complex problems.

Career Highlights: With a career spanning over two decades, James S Papanu has worked tirelessly to bring his ideas to life through the patenting process, solidifying his reputation as a forward-thinker in the industry.

Collaborations: Throughout his career, James S Papanu has collaborated with leading tech companies, research institutions, and universities to further develop and refine his inventions, demonstrating his commitment to pushing the boundaries of innovation.

Conclusion: James S Papanu's passion for innovation and his dedication to creating groundbreaking technologies have established him as a prominent figure in the world of inventors, with his work continuing to inspire future generations of innovators.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…