The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Sep. 27, 2021
Applied Materials, Inc., Santa Clara, CA (US);
Prayudi Lianto, Singapore, SG;
Yin Wei Lim, Singapore, SG;
James S. Papanu, San Rafael, CA (US);
Guan Huei See, Singapore, SG;
Eric J. Bergman, Kalispell, MT (US);
Nur Yasmeen Addina Mohamed Helmi Isik, Singapore, SG;
Wei Ying Doreen Yong, Singapore, SG;
Vicknesh Sahmuganathan, Singapore, SG;
Yi Kun Kelvin Goh, Singapore, SG;
John Leonard Sudijono, Singapore, SG;
Arvind Sundarrajan, Singapore, SG;
Applied Materials Inc., Santa Clara, CA (US);
Abstract
Methods and apparatus for processing a substrate are provided herein. For example, methods for enhancing surface hydrophilicity on a substrate comprise a) supplying, using a remote plasma source, water vapor plasma to a processing volume of a plasma processing chamber to treat a bonding surface of the substrate, b) supplying at least one of microwave power or RF power at a frequency from about 1 kHz to 10 GHz and a power from about 1 kW to 10 kW to the plasma processing chamber to maintain the water vapor plasma within the processing volume during operation, and c) continuing a) and b) until the bonding surface of the substrate has a hydrophilic contact angle of less than 10°.