Arvind Sundarrajan

This inventor holds 65 USPTO granted patents and 14 published patent applications, primarily in Advanced Packaging (CPC class H01L). Top assignees: Applied Materials, Inc., National University of Singapore. Active years: 2001-2026.

USPTO Granted Patents = 65 (Patent Applications = 14)

% Patents Active = 69.2

Average Co-Inventor Count = 4.6

ph-index = 9

Forward Citations = 291(Granted Patents)

Forward Citations (Not Self Cited) = 271(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Sunnyvale, CA (US) (2010)
Santa Clara, CA (US) (2001 - 2018)
San Jose, CA (US) (2010 - 2021)
Singapore, SG (2016 - 2024)

Company Filing History:

65 out of 14,403

Applied Materials, Inc.

patents

1 out of 850

National University of Singapore

patents

where one patent can have more than one assignee

Years Active: 2001-2026

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Areas of Expertise:

Through-Silicon Vias

Wafer Thinning

Substrate Bonding

Microwave Tunable Dielectrics

Wafer-Level Packaging

Chemical Mechanical Polishing

Magnetic Core Inductor

3D MIM Capacitors

Surface Hydrophilicity

Adhesive-less Bonding

Substrate Processing

Backside Via Reveal

65 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12685099 - Method of multi-layer die stacking with die-to-wafer bonding (2026-07-14),

2. 12635494 - Embedding redistribution layer metal traces in a polymeric dielectric (2026-05-19),

3. 12610587 - Backside power rail to deep vias (2026-04-21),

4. 12557343 - Method of ultra thinning of wafer (2026-02-17),

5. 12495582 - Self-aligned wide backside power rail contacts to multiple transistor sources (2025-12-09),

6. 12469683 - Water vapor plasma to enhance surface hydrophilicity (2025-11-11),

7. 12424446 - Silicon (Si) dry etch for die-to-wafer thinning (2025-09-23),

8. 12374586 - Methods of TSV formation for advanced packaging (2025-07-29),

9. 12138742 - Methods and apparatus for processing a substrate (2024-11-12),

10. 12048948 - Methods for forming microwave tunable composited thin-film dielectric layer (2024-07-30),

11. 12020992 - Methods and apparatus for processing a substrate (2024-06-25),

12. 11854886 - Methods of TSV formation for advanced packaging (2023-12-26),

13. 11791094 - Semiconductor substrate having magnetic core inductor (2023-10-17),

14. 11421316 - Methods and apparatus for controlling warpage in wafer level packaging processes (2022-08-23),

15. 11404318 - Methods of forming through-silicon vias in substrates for advanced packaging (2022-08-02),

Title: Arvind Sundarrajan - Pioneering Inventor from Singapore

Introduction: Arvind Sundarrajan is a highly accomplished inventor hailing from Singapore, known for his groundbreaking innovations in various fields.

Latest Patents: Arvind Sundarrajan holds several patents in the areas of technology and healthcare, showcasing his continuous dedication to pushing the boundaries of innovation.

Career Highlights: With a career spanning over two decades, Arvind has worked with prestigious research institutions and leading companies, contributing significantly to the advancement of cutting-edge technologies.

Collaborations: Throughout his career, Arvind has collaborated with top experts in the industry, fostering a culture of innovation and knowledge-sharing that has led to remarkable breakthroughs.

Conclusion: Arvind Sundarrajan's passion for innovation and his relentless pursuit of excellence make him a true trailblazer in the world of inventions, inspiring the next generation of inventors to dream big and create a better future.