The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2022
Filed:
Sep. 26, 2019
Applied Materials, Inc., Santa Clara, CA (US);
Prayudi Lianto, Singapore, SG;
Mohamed Rafi, Singapore, SG;
Muhammad Azim Bin Syed Sulaiman, Singapore, SG;
Guan Huei See, Singapore, SG;
Ang Yu Xin Kristy, Singapore, SG;
Karthik Elumalai, Bangalore, IN;
Sriskantharajah Thirunavukarasu, Singapore, SG;
Arvind Sundarrajan, Singapore, SG;
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Abstract
Methods and apparatus for producing fine pitch patterning on a substrate. Warpage correction of the substrate is accomplished on a carrier or carrier-less substrate. A first warpage correction process is performed on the substrate by raising and holding a temperature of the substrate to a first temperature and cooling the carrier-less substrate to a second temperature. Further wafer level packaging processing is then performed such as forming vias in a polymer layer on the substrate. A second warpage correction process is then performed on the substrate by raising and holding a temperature of the substrate to a third temperature and cooling the substrate to a fourth temperature. With the warpage of the substrate reduced, a redistribution layer may be formed on the substrate with a 2/2 μm l/s fine pitch patterning.