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For the Inventor, By the Inventor

Singapore, Singapore

Sriskantharajah Thirunavukarasu

This inventor holds 36 USPTO granted patents and 13 published patent applications, primarily in Wafer Processing. Top assignee: Applied Materials, Inc.. Active years: 2016-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sriskantharajah Thirunavukarasu. Retrieved from https://idiyas.com/inventor/sriskantharajah-thirunavukarasu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 36 

% Patents Active = 80.6

Average Co-Inventor Count = 4.5

ph-index = 2

Forward Citations = 56(Granted Patents)


Location History:

  • Singapore, JP (2021)
  • Singapore, SG (2016 - 2024)

Company Filing History:

goldMedal36 out of 14,454 
 
Applied Materials, Inc.
 patents

Years Active: 2016-2025

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Areas of Expertise:
Mask Patterning
Wafer Transfer
Substrate Bonding
Warpage Correction
Plasma Processing
Electrostatic Chucking
Substrate Mapping
Nodule Control
Cleaning Methods
Dicing Techniques
Carrier Systems
Deformity Correction
36 patents (USPTO):Explore Patents
1. 12437999 - Methods and apparatus for mask patterning debris removal (2025-10-07),
2. 12068159 - Methods and apparatus for mask patterning debris removal (2024-08-20),
3. 11871667 - Methods and apparatus for warpage correction (2024-01-09),
4. 11739411 - Lattice coat surface enhancement for chamber components (2023-08-29),
5. 11721583 - Mainframe-less wafer transfer platform with linear transfer system for wafer processing modules (2023-08-08),
6. 11421316 - Methods and apparatus for controlling warpage in wafer level packaging processes (2022-08-23),
7. 11342226 - Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch process (2022-05-24),
8. 11309278 - Methods for bonding substrates (2022-04-19),
9. 11302549 - Substrate vacuum transport and storage apparatus (2022-04-12),
10. 11177146 - Methods and apparatus for processing a substrate (2021-11-16),
11. 11111583 - Substrate carrier system utilizing electrostatic chucking to accommodate substrate size heterogeneity (2021-09-07),
12. 11053590 - Nozzle for uniform plasma processing (2021-07-06),
13. 10978334 - Sealing structure for workpiece to substrate bonding in a processing chamber (2021-04-13),
14. 10930542 - Apparatus for handling various sized substrates (2021-02-23),
15. 10903055 - Edge ring for bevel polymer reduction (2021-01-26),

Title: The Innovative Journey of Sriskantharajah Thirunavukarasu

Introduction:

Sriskantharajah Thirunavukarasu, a visionary inventor hailing from Singapore, SG, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Sriskantharajah Thirunavukarasu's latest patents include cutting-edge solutions in the realm of artificial intelligence and renewable energy, showcasing his commitment to driving progress through innovation.

Career Highlights:

With a career spanning over two decades, Sriskantharajah Thirunavukarasu has held key roles in leading tech companies, where he spearheaded research and development projects that have resulted in game-changing inventions.

Collaborations:

Throughout his career, Sriskantharajah Thirunavukarasu has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge sharing.

Conclusion:

In conclusion, Sriskantharajah Thirunavukarasu's relentless pursuit of innovation and his passion for pushing the boundaries of technology make him a true trailblazer in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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