The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2023

Filed:

Aug. 10, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Sriskantharajah Thirunavukarasu, Singapore, SG;

Karthik Balakrishnan, Singapore, SG;

Karthik Elumalai, Singapore, SG;

Eng Sheng Peh, Singapore, SG;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/673 (2006.01); H01L 21/677 (2006.01); B23K 26/364 (2014.01); H01L 23/544 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B23K 26/364 (2015.10); H01L 21/673 (2013.01); H01L 21/67739 (2013.01); H01L 23/544 (2013.01); B23K 2101/40 (2018.08); H01L 2223/5446 (2013.01);
Abstract

In an embodiment, a semiconductor processing tool for implementing hybrid laser and plasma dicing of a substrate is provided. The semiconductor processing tool comprises a transfer module, where the transfer module comprises a track robot for handling the substrate, and a loadlock attached to the transfer module. In an embodiment, the loadlock comprises a linear transfer system for handling the substrate. In an embodiment, the processing tool further comprises a processing chamber attached to the loadlock, wherein the linear transfer system of the loadlock is configured to insert and remove the substrate from the processing chamber.


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