The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2024

Filed:

Mar. 31, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Karthik Narayanan Balakrishnan, Singapore, SG;

Jungrae Park, Cupertino, CA (US);

Arunkumar Tatti, Haveri, IN;

Sriskantharajah Thirunavukarasu, Singapore, SG;

Eng Sheng Peh, Singapore, SG;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2006.01); B23K 26/14 (2014.01); B23K 26/142 (2014.01); B23K 101/40 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0337 (2013.01); B23K 26/142 (2015.10); B23K 26/1436 (2015.10); B23K 26/1437 (2015.10); H01L 21/78 (2013.01); B23K 2101/40 (2018.08);
Abstract

Methods and apparatus for laser patterning leverage mask trench debris removal techniques to form etch singulation trenches. In some embodiments, the method includes forming a mask layer on the wafer, forming a pattern in the mask layer using a laser of a laser assembly where the pattern allows singulation of the wafer by deep etching and forms a trench in the mask layer with a laser beam which has a process point at a bottom of the trench, directing gas nozzles that flow a pressurized gas at the process point in the trench as the pattern is formed with a gas flow angle relative to the process point and evacuating debris from the trench using an area of negative pressure where the gas flow from gas nozzles and the area of negative pressure are in fluid contact and are confined within a cylindrical housing.


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