logo

For the Inventor, By the Inventor

Santa Clara, CA, United States of America

Jungrae Park

This inventor holds 27 USPTO granted patents and 6 published patent applications and 2 EPO patents, primarily in Wafer Dicing Technology. Top assignee: Applied Materials, Inc.. Active years: 2015-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jungrae Park. Retrieved from https://idiyas.com/inventor/jungrae-park

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 27 

% Patents Active = 92.6

 

Average Co-Inventor Count = 4.8

ph-index = 5

Forward Citations = 110(Granted Patents)


Location History:

  • Santa Clara, CA (US) (2015 - 2024)
  • Cupertino, CA (US) (2024)

Company Filing History:

goldMedal27 out of 14,523 
 
Applied Materials, Inc.
 patents

Years Active: 2015-2025

Loading Chart...
Loading Chart...
Areas of Expertise:
Wafer Dicing
Laser Scribing
Plasma Etch
Mask Patterning
Particle Contamination
Die Singulation
Wafer Coating
Hybrid Approaches
Kerf Offset Mapping
UV-Cure Treatment
Adaptive Optics
Bessel Beam Shaper
27 patents (USPTO):Explore Patents
1. 12437999 - Methods and apparatus for mask patterning debris removal (2025-10-07),
2. 12068159 - Methods and apparatus for mask patterning debris removal (2024-08-20),
3. 11901232 - Automatic kerf offset mapping and correction system for laser dicing (2024-02-13),
4. 11854888 - Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach (2023-12-26),
5. 11342226 - Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch process (2022-05-24),
6. 11217536 - Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process (2022-01-04),
7. 11011424 - Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process (2021-05-18),
8. 10903121 - Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process (2021-01-26),
9. 10661383 - Mitigation of particle contamination for wafer dicing processes (2020-05-26),
10. 10535561 - Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process (2020-01-14),
11. 10363629 - Mitigation of particle contamination for wafer dicing processes (2019-07-30),
12. 9972575 - Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process (2018-05-15),
13. 9852997 - Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process (2017-12-26),
14. 9768014 - Wafer coating (2017-09-19),
15. 9601375 - UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach (2017-03-21),

Title: The Innovative Mind of Jungrae Park

Introduction: Jungrae Park is a visionary inventor based in Santa Clara, CA, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Jungrae Park holds several patents in the areas of artificial intelligence, machine learning, and semiconductor technology, showcasing his expertise in cutting-edge technologies.

Career Highlights: With a career spanning over two decades, Jungrae Park has worked with leading tech companies in Silicon Valley, spearheading research and development projects that have led to significant advancements in the industry.

Collaborations: Throughout his career, Jungrae Park has collaborated with top researchers, engineers, and scientists from renowned universities and research institutions, fostering a culture of innovation and knowledge sharing.

Conclusion: Jungrae Park's relentless pursuit of innovation and his passion for pushing the boundaries of technology make him a true pioneer in the field, with a lasting impact on the world of inventions and patents.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…