The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2019
Filed:
Jun. 01, 2017
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Wei-Sheng Lei, San Jose, CA (US);
Jungrae Park, Santa Clara, CA (US);
Ajay Kumar, Cupertino, CA (US);
Brad Eaton, Menlo Park, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B23K 26/0622 (2014.01); H01L 21/3065 (2006.01); H01L 21/02 (2006.01); H01L 21/308 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 21/67 (2006.01); B23K 26/06 (2014.01); B23K 26/18 (2006.01); B23K 26/402 (2014.01); B23K 26/364 (2014.01); B23K 101/42 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0624 (2015.10); B23K 26/0661 (2013.01); B23K 26/18 (2013.01); B23K 26/364 (2015.10); B23K 26/402 (2013.01); H01L 21/02057 (2013.01); H01L 21/3065 (2013.01); H01L 21/3081 (2013.01); H01L 21/67092 (2013.01); H01L 21/67132 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); B23K 2101/42 (2018.08); B23K 2103/50 (2018.08); B23K 2103/56 (2018.08);
Abstract
Methods of dicing semiconductor wafers are described. In an example, a method of dicing a wafer having a plurality of integrated circuits thereon involves dicing the wafer into a plurality of singulated dies disposed above a dicing tape. The method also involves forming a material layer over and between the plurality of singulated dies above the dicing tape. The method also includes expanding the dicing tape, wherein a plurality of particles is collected on the material layer during the expanding.