The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

Jun. 22, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Karthik Balakrishnan, Singapore, SG;

Jungrae Park, Santa Clara, CA (US);

Zavier Zai Yeong Tan, Singapore, SG;

Sai Abhinand, Singapore, SG;

James S. Papanu, San Rafael, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/3065 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/0275 (2013.01); H01L 21/3065 (2013.01);
Abstract

Embodiments of the present disclosure include methods of determining scribing offsets in a hybrid laser scribing and plasma dicing process. In an embodiment, the method comprises forming a mask above a semiconductor wafer. In an embodiment, the semiconductor wafer comprises a plurality of dies separated from each other by streets. In an embodiment, the method further comprises patterning the mask and the semiconductor wafer with a laser scribing process. In an embodiment, the patterning provides openings in the streets. In an embodiment, the method further comprises removing the mask, and measuring scribing offsets of the openings relative to the streets.


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