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For the Inventor, By the Inventor

Singapore, Singapore

Prayudi Lianto

This inventor holds 21 USPTO granted patents and 14 published patent applications and 1 EPO patent, primarily in Semiconductor Processing. Top assignees: Applied Materials, Inc., National University of Singapore. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Prayudi Lianto. Retrieved from https://idiyas.com/inventor/prayudi-lianto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 21 

% Patents Active = 81.0

 

Average Co-Inventor Count = 5.8

ph-index = 2

Forward Citations = 10(Granted Patents)


Location History:

  • Singapore, SG (2018 - 2024)
  • Lorong G Telok Kurau, SG (2024)

Company Filing History:

goldMedal21 out of 14,502 
 
Applied Materials, Inc.
 patents
silverMedal1 out of 857 
 
National University of Singapore
 patents
where one patent can have more than one assignee

Years Active: 2018-2026

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Areas of Expertise:
Optical Inspection
Dielectric Films
Metal Gapfill
Wafer Processing
Surface Hydrophilicity
Silicon Etch
Planarization
Alignment Marks
Diffusion Layers
Wafer Level Packaging
RF Applications
Chemical Mechanical Polishing
21 patents (USPTO):Explore Patents
1. 12694505 - Pre-bonding automatic optical inspection defect classification (2026-07-28),
2. 12615976 - Methods for depositing dielectric films with increased stability (2026-04-28),
3. 12588533 - Grain structure engineering for metal gapfill materials (2026-03-24),
4. 12518367 - Defect classification of processed wafers (2026-01-06),
5. 12469683 - Water vapor plasma to enhance surface hydrophilicity (2025-11-11),
6. 12424446 - Silicon (Si) dry etch for die-to-wafer thinning (2025-09-23),
7. 12138742 - Methods and apparatus for processing a substrate (2024-11-12),
8. 12020992 - Methods and apparatus for processing a substrate (2024-06-25),
9. 11931855 - Planarization methods for packaging substrates (2024-03-19),
10. 11901225 - Diffusion layers in metal interconnects (2024-02-13),
11. 11899376 - Methods for forming alignment marks (2024-02-13),
12. 11421316 - Methods and apparatus for controlling warpage in wafer level packaging processes (2022-08-23),
13. 11355358 - Methods of thinning silicon on epoxy mold compound for radio frequency (RF) applications (2022-06-07),
14. 11342256 - Method of fine redistribution interconnect formation for advanced packaging applications (2022-05-24),
15. 11309278 - Methods for bonding substrates (2022-04-19),

Title: The Innovative Journey of Prayudi Lianto

Introduction:

Prayudi Lianto, a visionary inventor hailing from Singapore, SG, has made significant contributions to the world of technology and innovation through his groundbreaking inventions.

Latest Patents:

Prayudi Lianto's latest patents include cutting-edge technologies in the fields of artificial intelligence, renewable energy, and sustainable materials, showcasing his commitment to creating a more sustainable future.

Career Highlights:

With a career spanning over two decades, Prayudi Lianto has established himself as a leading figure in the innovation landscape. His work has not only revolutionized industries but has also inspired a new generation of inventors.

Collaborations:

Prayudi Lianto has collaborated with top research institutions, universities, and multinational companies to bring his inventions to life. His ability to work across disciplines and borders has led to the development of truly groundbreaking technologies.

Conclusion:

In conclusion, Prayudi Lianto's passion for innovation, coupled with his relentless drive to push the boundaries of what is possible, has solidified his position as a trailblazer in the world of inventions. His work continues to shape the future and inspire others to think beyond the conventional.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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