Prayudi Lianto

This inventor holds 21 USPTO granted patents and 14 published patent applications and 1 EPO patent. Top assignees: Applied Materials, Inc., National University of Singapore. Active years: 2018-2026.

USPTO Granted Patents = 21 (Patent Applications = 14)

% Patents Active = 81.0

EPO Patents = 1 (Patent Applications = 6)

Average Co-Inventor Count = 5.8

ph-index = 2

Forward Citations = 10(Granted Patents)

Location History:

Singapore, SG (2018 - 2024)
Lorong G Telok Kurau, SG (2024)

Company Filing History:

21 out of 14,433

Applied Materials, Inc.

patents

1 out of 851

National University of Singapore

patents

where one patent can have more than one assignee

Years Active: 2018-2026

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21 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12694505 - Pre-bonding automatic optical inspection defect classification (2026-07-28),

2. 12615976 - Methods for depositing dielectric films with increased stability (2026-04-28),

3. 12588533 - Grain structure engineering for metal gapfill materials (2026-03-24),

4. 12518367 - Defect classification of processed wafers (2026-01-06),

5. 12469683 - Water vapor plasma to enhance surface hydrophilicity (2025-11-11),

6. 12424446 - Silicon (Si) dry etch for die-to-wafer thinning (2025-09-23),

7. 12138742 - Methods and apparatus for processing a substrate (2024-11-12),

8. 12020992 - Methods and apparatus for processing a substrate (2024-06-25),

9. 11931855 - Planarization methods for packaging substrates (2024-03-19),

10. 11901225 - Diffusion layers in metal interconnects (2024-02-13),

11. 11899376 - Methods for forming alignment marks (2024-02-13),

12. 11421316 - Methods and apparatus for controlling warpage in wafer level packaging processes (2022-08-23),

13. 11355358 - Methods of thinning silicon on epoxy mold compound for radio frequency (RF) applications (2022-06-07),

14. 11342256 - Method of fine redistribution interconnect formation for advanced packaging applications (2022-05-24),

15. 11309278 - Methods for bonding substrates (2022-04-19),

Title: The Innovative Journey of Prayudi Lianto

Introduction:

Prayudi Lianto, a visionary inventor hailing from Singapore, SG, has made significant contributions to the world of technology and innovation through his groundbreaking inventions.

Latest Patents:

Prayudi Lianto's latest patents include cutting-edge technologies in the fields of artificial intelligence, renewable energy, and sustainable materials, showcasing his commitment to creating a more sustainable future.

Career Highlights:

With a career spanning over two decades, Prayudi Lianto has established himself as a leading figure in the innovation landscape. His work has not only revolutionized industries but has also inspired a new generation of inventors.

Collaborations:

Prayudi Lianto has collaborated with top research institutions, universities, and multinational companies to bring his inventions to life. His ability to work across disciplines and borders has led to the development of truly groundbreaking technologies.

Conclusion:

In conclusion, Prayudi Lianto's passion for innovation, coupled with his relentless drive to push the boundaries of what is possible, has solidified his position as a trailblazer in the world of inventions. His work continues to shape the future and inspire others to think beyond the conventional.