The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
Mar. 30, 2023
Applied Materials, Inc., Santa Clara, CA (US);
Rahul Reddy Komatireddi, Bangalore, IN;
Rohith Cherikkallil, Bangalore, IN;
Sneha Rupa Kongara, Bangalore, IN;
Satwik Swarup Mishra, Bengaluru, IN;
Sachin Dangayach, San Jose, CA (US);
Si En Chan, Singapore, SG;
Remus Zhen Hui Koh, Singapore, SG;
Prayudi Lianto, Singapore, SG;
Yin Wei Lim, Singapore, SG;
Peng Suo, Singapore, SG;
Krishnaprasad Reddy Mallavaram, Bengaluru, IN;
Khor Wui Cheng, Singapore, SG;
Applied Materials Inc., Santa Clara, CA (US);
Abstract
A method and apparatus for training a learning model for automatic defect detection and classification of at least a portion of a processed wafer include receiving labeled images having defect classification types and features for portions of a post-processed wafer, creating a first training set comprising the received labeled images, training the machine learning model to automatically classify wafer portions based on at least one detected defect in respective wafer portions using the first training set, receiving labeled wafer profiles having respective downstream yield data, creating a second training set comprising the labeled wafer profiles and training the machine learning model, using the second training set, to automatically determine a respective downstream yield of a wafer based on a respective wafer profile. The machine learning model can be applied to at least one unlabeled wafer image to determine at least one defect classification for at least one portion of a wafer.