Singapore, Singapore

Peng Suo

USPTO Granted Patents = 7 

Average Co-Inventor Count = 4.3

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Singapore Science Park, SG (2019)
  • Singapore, SG (2020 - 2023)

Company Filing History:


Years Active: 2019-2025

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7 patents (USPTO):

Title: The Innovative Contributions of Peng Suo

Introduction

Peng Suo is a prominent inventor based in Singapore, SG, known for his significant contributions to semiconductor packaging technology. With a total of 7 patents to his name, he has made remarkable advancements in the field, particularly in the area of through-via structures.

Latest Patents

Among his latest patents, Peng Suo has developed methods for TSV (Through-Silicon Via) formation for advanced packaging. These patents focus on through-via structures with dielectric shielding of interconnections for advanced wafer-level semiconductor packaging. The methods described enable the formation of high-thickness dielectric shielding layers within low aspect ratio through-via structures. This innovation facilitates the creation of thin and small-form-factor package structures that possess high I/O density, improved bandwidth, and enhanced power efficiency.

Career Highlights

Peng Suo is currently employed at Applied Materials, Inc., a leading company in the field of materials engineering. His work at Applied Materials has allowed him to push the boundaries of semiconductor technology and contribute to the development of cutting-edge packaging solutions.

Collaborations

Throughout his career, Peng Suo has collaborated with notable colleagues, including Guan Huei See and Arvind Sundarrajan. These collaborations have further enriched his work and contributed to the advancement of semiconductor packaging technologies.

Conclusion

Peng Suo's innovative work in semiconductor packaging, particularly in TSV formation, showcases his expertise and commitment to advancing technology. His contributions have significant implications for the future of high-density electronic packaging.

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