The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2024
Filed:
May. 28, 2020
Applied Materials, Inc., Santa Clara, CA (US);
Han-Wen Chen, Cupertino, CA (US);
Steven Verhaverbeke, San Francisco, CA (US);
Tapash Chakraborty, Maharashtra, IN;
Prayudi Lianto, Singapore, SG;
Prerna Sonthalia Goradia, Mumbai, IN;
Giback Park, San Jose, CA (US);
Chintan Buch, Santa Clara, CA (US);
Pin Gian Gan, Singapore, SG;
Alex Hung, Singapore, SG;
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Embodiments of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates. More specifically, embodiments of the present disclosure relate to planarization of surfaces on substrates for advanced packaging applications, such as surfaces of polymeric material layers. In one implementation, the method includes mechanically grinding a substrate surface against a polishing surface in the presence of a grinding slurry during a first polishing process to remove a portion of a material formed on the substrate; and then chemically mechanically polishing the substrate surface against the polishing surface in the presence of a polishing slurry during a second polishing process to reduce any roughness or unevenness caused by the first polishing process.