Alex Hung

Title: Alex Hung - Innovator in Planarization Methods

Introduction

Alex Hung is a notable inventor based in Singapore, SG. He has made significant contributions to the field of advanced packaging applications through his innovative work in planarization methods. His expertise and dedication to improving substrate surfaces have led to the development of a valuable patent.

Latest Patents

Alex Hung holds a patent for "Planarization methods for packaging substrates." This patent focuses on the planarization of surfaces on substrates and layers formed on substrates. The method involves mechanically grinding a substrate surface against a polishing surface using a grinding slurry during a first polishing process. This process removes a portion of the material formed on the substrate. Following this, a chemical mechanical polishing process is employed to reduce any roughness or unevenness caused by the initial grinding.

Career Highlights

Alex Hung is currently associated with Applied Materials, Inc., where he continues to innovate and contribute to the field of materials engineering. His work is instrumental in enhancing the quality and performance of packaging substrates, which are crucial for various electronic applications.

Collaborations

Throughout his career, Alex has collaborated with talented professionals, including Han-Wen Chen and Steven Verhaverbeke. These collaborations have fostered a creative environment that encourages the exchange of ideas and advancements in technology.

Conclusion

In summary, Alex Hung is a distinguished inventor whose work in planarization methods has made a significant impact on advanced packaging applications. His contributions continue to shape the future of materials engineering.