Applied Materials, Inc.

Alex Hung

Steven Verhaverbeke

Han-Wen Chen

Prerna Sonthalia Goradia

Giback Park

Prayudi Lianto

Chintan Buch

Tapash Chakraborty

Pin Gian Gan

Embodiments of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates. More specifically, embodiments of the present disclosure relate to planarization of surfaces on substrates for advanced packaging applications, such as surfaces of polymeric material layers. In one implementation, the method includes mechanically grinding a substrate surface against a polishing surface in the presence of a grinding slurry during a first polishing process to remove a portion of a material formed on the substrate; and then chemically mechanically polishing the substrate surface against the polishing surface in the presence of a polishing slurry during a second polishing process to reduce any roughness or unevenness caused by the first polishing process.

Planarization methods for packaging substrates

Growing community of inventors

Singapore, Singapore

Alex Hung