This inventor holds 2 USPTO granted patents and 3 published patent applications. Top assignee: Applied Materials, Inc.. Active years: 2022-2024.
Company Filing History:
Years Active: 2022-2024
Title: Innovations by Pin Gian Gan
Introduction
Pin Gian Gan is a notable inventor based in Singapore, SG. He has made significant contributions to the field of advanced packaging applications, holding a total of 2 patents. His work focuses on improving the efficiency and effectiveness of substrate processing methods.
Latest Patents
One of his latest patents is titled "Planarization methods for packaging substrates." This patent addresses the planarization of surfaces on substrates and layers formed on substrates. The method involves mechanically grinding a substrate surface against a polishing surface with a grinding slurry during a first polishing process. This process aims to remove a portion of the material formed on the substrate. Following this, a chemical mechanical polishing process is employed to reduce any roughness or unevenness caused by the initial grinding.
Another significant patent is "Methods and apparatus for backside via reveal processing." This invention outlines a centralized control framework for multiple process tools involved in backside via reveal processes. The method includes receiving operational parameters from process tools and sensor metrology data. It allows for adjustments to be made to prevent backside via breakage during the chemical mechanical polishing process.
Career Highlights
Pin Gian Gan is currently employed at Applied Materials, Inc., where he continues to innovate in the field of substrate processing. His expertise in planarization and backside via reveal processes has positioned him as a key contributor to advancements in packaging technologies.
Collaborations
He has collaborated with notable coworkers such as Prayudi Lianto and Han-Wen Chen, further enhancing the innovative environment at Applied Materials, Inc.
Conclusion
Pin Gian Gan's contributions to the field of substrate processing through his patents demonstrate his commitment to innovation and excellence. His work continues to influence advanced packaging applications, making significant strides in the industry.