The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Jul. 31, 2020
Applied Materials, Inc., Santa Clara, CA (US);
Prayudi Lianto, Singapore, SG;
Sik Hin Chi, Singapore, SG;
Shih-Chao Hung, Singapore, SG;
Pin Gian Gan, Singapore, SG;
Ricardo Fujii Vinluan, Singapore, SG;
Gaurav Mehta, Singapore, SG;
Ramesh Chidambaram, Singapore, SG;
Guan Huei See, Singapore, SG;
Arvind Sundarrajan, Singapore, SG;
Upendra V. Ummethala, Cupertino, CA (US);
Wei Hao Kew, Singapore, SG;
Muhammad Adli Danish Bin Abdullah, Singapore, SG;
Michael Charles Kutney, Santa Clara, CA (US);
Mark McTaggart Wylie, Meridian, ID (US);
Amulya Ligorio Athayde, Palo Alto, CA (US);
Glen T. Mori, Gilroy, CA (US);
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Abstract
Methods and apparatus perform backside via reveal processes using a centralized control framework for multiple process tools. In some embodiments, a method for performing a backside via reveal process may include receiving process tool operational parameters from process tools involved in the backside via reveal process by a central controller, receiving sensor metrology data from at least one or more of the process tools involved in the backside via reveal process, and altering the backside reveal process based, at least in part, on the process tool operational parameters and the sensor metrology data by adjusting two or more of the process tools involved in the backside via reveal process. The profile parameters are configured to prevent backside via breakage during a chemical mechanical polishing (CMP) process.