This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Applied Materials, Inc.. Active years: 2022.
Company Filing History:
Years Active: 2022
Title: Shih-Chao Hung: Innovator in Backside Via Reveal Processing
Introduction
Shih-Chao Hung is a notable inventor based in Singapore, recognized for her contributions to the field of semiconductor processing. With a focus on innovative methods and apparatus, she has made significant strides in enhancing the efficiency and effectiveness of backside via reveal processes.
Latest Patents
Shih-Chao Hung holds a patent titled "Methods and apparatus for backside via reveal processing." This patent describes methods and apparatus that perform backside via reveal processes using a centralized control framework for multiple process tools. The method involves receiving process tool operational parameters and sensor metrology data from the involved process tools. It also includes altering the backside reveal process based on these parameters to prevent backside via breakage during a chemical mechanical polishing (CMP) process. This innovation is crucial for improving the reliability and performance of semiconductor devices.
Career Highlights
Shih-Chao Hung is currently employed at Applied Materials, Inc., a leading company in the semiconductor industry. Her work focuses on developing advanced technologies that enhance manufacturing processes. With her expertise, she has contributed to the advancement of semiconductor fabrication techniques.
Collaborations
Shih-Chao has collaborated with notable colleagues, including Michael C Kutney and Gaurav Mehta. These collaborations have fostered an environment of innovation and have led to significant advancements in their respective fields.
Conclusion
Shih-Chao Hung's contributions to backside via reveal processing exemplify her commitment to innovation in the semiconductor industry. Her patent and collaborative efforts highlight her role as a key player in advancing technology.