The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Aug. 14, 2024
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Wei-Sheng Lei, San Jose, CA (US);

Mahendran Chidambaram, Saratoga, CA (US);

Kangkang Wang, San Jose, CA (US);

Ludovic Godet, Sunnyvale, CA (US);

Visweswaren Sivaramakrishnan, Cupertino, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 33/02 (2006.01); B23K 26/00 (2014.01); B23K 26/0622 (2014.01); B23K 26/064 (2014.01); B23K 26/08 (2014.01); B23K 26/55 (2014.01); C03B 33/10 (2006.01); C03C 23/00 (2006.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
C03B 33/0222 (2013.01); B23K 26/0006 (2013.01); B23K 26/0624 (2015.10); B23K 26/0652 (2013.01); B23K 26/0861 (2013.01); B23K 26/55 (2015.10); C03B 33/102 (2013.01); C03C 23/0025 (2013.01); B23K 2101/40 (2018.08); B23K 2103/42 (2018.08); B23K 2103/50 (2018.08); B23K 2103/54 (2018.08); B23K 2103/56 (2018.08); B29C 2791/009 (2013.01);
Abstract

A method includes forming a plurality of voids within a substrate along a dicing path by exposing the substrate to a first burst of laser pulses at a first location along the dicing path of a respective waveguide combiner. The substrate has a plurality of waveguides. Each laser pulse within the first burst forms a respective void within a first column at the first location to form the plurality of voids. The method further includes exposing the substrate to a second burst of laser pulses at a second location along the dicing path of the respective waveguide combiner. Each laser pulse within the second burst forms the respective void within a second column at the second location to form the plurality of voids. The first column and the second column are spaced by a pitch between a center of the first column and the second column along the dicing path.


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