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For the Inventor, By the Inventor

Hsinchu, Taiwan

Teng-Hao Yeh

This inventor holds 87 USPTO granted patents and 17 published patent applications and 3 EPO patents, primarily in 3D Memory Technology (CPC class H01L27-11582). Top assignees: Macronix International Co., Ltd., Sinopower Semiconductor, Inc., Macronix Internationalco., Ltd.. Active years: 2013-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Teng-Hao Yeh. Retrieved from https://idiyas.com/inventor/teng-hao-yeh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 87 

% Patents Active = 98.9

 

Average Co-Inventor Count = 2.6

ph-index = 8

Forward Citations = 365(Granted Patents)

Forward Citations (Not Self Cited) = 335(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Hsinchu, TW (2013 - 2023)
  • Hsinchu County, TW (2020 - 2024)
  • Zhubei, TW (2020 - 2024)

Company Filing History:

goldMedal84 out of 3,609 
 
Macronix International Co., Ltd.
 patents
silverMedal2 out of 20 
 
Sinopower Semiconductor, Inc.
 patents
bronzeMedal1 out of 12 
 
Macronix Internationalco., Ltd.
 patents

Years Active: 2013-2025

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Areas of Expertise:
3D Memory
Flash Memory
High Density Memory
Thermal Anneal Circuits
Ternary Content Addressable Memory
In-Memory Computing
Semiconductor Structures
Artificial Intelligence Accelerator
Data Sensing
Integrated Circuit
Memory Device
87 patents (USPTO):Explore Patents
1. 12469799 - 3D memory device and method of forming seal structure (2025-11-11),
2. 12464725 - 3D circuit structure with stairstep contact configuration (2025-11-04),
3. 12437820 - Memory including thermal anneal circuits and methods for operating the same (2025-10-07),
4. 12406735 - 3D memory (2025-09-02),
5. 12327594 - 3D flash memory module chip and method of fabricating the same (2025-06-10),
6. 12260130 - Memory device for computing in-memory (2025-03-25),
7. 12254949 - Memory device (2025-03-18),
8. 12254915 - Integrated circuit structure and method for forming and operating the same (2025-03-18),
9. 12245428 - 3D AND flash memory device and method of fabricating the same (2025-03-04),
10. 12245413 - Three-dimensional semiconductor structures (2025-03-04),
11. 12200933 - 3D and flash memory device (2025-01-14),
12. 12198770 - Memory device for increasing speed of soft-program operation (2025-01-14),
13. 12198752 - High density memory with reference memory using grouped cells and corresponding operations (2025-01-14),
14. 12131772 - Three dimension memory device capable of improving sensing accuracy in high-speed data sensing operation (2024-10-29),
15. 12094518 - Memory device (2024-09-17),

Title: The Innovative Journey of Teng-Hao Yeh

Introduction:

Teng-Hao Yeh, a visionary inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents:

Teng-Hao Yeh's latest patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips for various applications.

Career Highlights:

Throughout his illustrious career, Teng-Hao Yeh has worked with leading tech companies in Taiwan, spearheading research and development projects that have pushed the boundaries of innovation in the semiconductor industry.

Collaborations:

Teng-Hao Yeh has collaborated with top research institutions and universities in Taiwan, fostering a culture of innovation and knowledge-sharing to drive technological advancements in the region.

Conclusion:

In conclusion, Teng-Hao Yeh's relentless pursuit of innovation and his passion for pushing the limits of technology have solidified his reputation as a pioneering inventor in the field of semiconductor technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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