Kaohsiung, Taiwan

Te-Hsien Hsieh


Average Co-Inventor Count = 3.3

ph-index = 2

Forward Citations = 11(Granted Patents)


Location History:

  • Kaohsiung County, TW (2012)
  • Kaoshiung, TW (2014)
  • Kaohsiung, TW (2013 - 2017)
  • Hsin-Chu, TW (2021 - 2023)

Company Filing History:


Years Active: 2012-2025

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18 patents (USPTO):

Title: Innovator Spotlight: Te-Hsien Hsieh from Kaohsiung, Taiwan

Introduction: Te-Hsien Hsieh is a prolific inventor based in Kaohsiung, Taiwan, recognized for his contributions to the field of semiconductor technology. With a remarkable portfolio of 15 patents, Hsieh has made significant strides in improving image sensor integrated chips and conductive structures in semiconductor applications.

Latest Patents: Hsieh's latest innovations include a patent for a channel pattern design aimed at enhancing carrier transfer efficiency within an image sensor integrated chip. This innovative design features a photodiode region situated within a substrate composed of a first semiconductor material region, which is topped with a second semiconductor material region. The inclusion of a patterned doped layer between these regions is pivotal for optimal performance.

Another noteworthy patent involves a mechanism to reduce cleaning time of a conductive structure through a via landing on first and second barrier layers. This invention integrates a conductive structure within a substrate or first dielectric layer, utilizing multiple barrier layers to streamline the electrical coupling with the conductive structure. These advancements demonstrate Hsieh’s dedication to enhancing semiconductor efficiency and functionality.

Career Highlights: Te-Hsien Hsieh has held influential positions at leading companies in the semiconductor industry, including United Microelectronics Corporation and Taiwan Semiconductor Manufacturing Company Limited. His expertise and innovative mindset have propelled numerous advancements in semiconductor technologies.

Collaborations: Throughout his career, Hsieh has worked alongside talented colleagues, including Jing-Yi Lee and Ming-Jui Chen. These collaborations have fostered an environment of innovation and excellence, contributing to the successful development of groundbreaking technologies.

Conclusion: Te-Hsien Hsieh's commitment to innovation in semiconductor technology is evident through his extensive patent portfolio. His advancements in image sensor integrated chips and conductive structures are instrumental in shaping the future of electronics. As a leading inventor, Hsieh continues to inspire the next generation of innovators in the field.

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