The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2025
Filed:
Jul. 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
In some embodiments, the present disclosure relates to an integrated chip that includes a conductive structure arranged within a substrate or a first dielectric layer. A first barrier layer is arranged on outermost sidewalls and a bottom surface of the conductive structure. A second barrier layer is arranged on outer surfaces of the first barrier layer. The second barrier layer separates the first barrier layer from the substrate or the first dielectric layer. A second dielectric layer is arranged over the substrate or the first dielectric layer. A via structure extends through the second dielectric layer, is arranged directly over topmost surfaces of the first and second barrier layers, and is electrically coupled to the conductive structure through the first and second barrier layers.