The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Aug. 03, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Te-Hsien Hsieh, Hsin-Chu, TW;

Tzu-Yu Chen, Kaohsiung, TW;

Kuo-Chi Tu, Hsin-Chu, TW;

Yuan-Tai Tseng, Zhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/24 (2006.01); H01L 45/00 (2006.01); G11C 13/00 (2006.01); H10B 63/00 (2023.01); H10N 70/00 (2023.01);
U.S. Cl.
CPC ...
H10B 63/30 (2023.02); G11C 13/0002 (2013.01); H10N 70/011 (2023.02); H10N 70/826 (2023.02); H10N 70/841 (2023.02);
Abstract

An RRAM cell stack is formed over an opening in a dielectric layer. The dielectric layer is sufficiently thick and the opening is sufficiently deep that an RRAM cell can be formed by a planarization process. The resulting RRAM cells may have a U-shaped profile. The RRAM cell area includes contributions from a bottom portion in which the RRAM cell layers are stacked parallel to the substrate and a side portion in which RRAM cell layers are stacked roughly perpendicular to the substrate. The combined side and bottom portions of the curved RRAM cell provide an increased area in comparison to a planar cell stack. The increased area lowers forming and set voltages for the RRAM cell.


Find Patent Forward Citations

Loading…