The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Jan. 27, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Te-Hsien Hsieh, Kaohsiung, TW;

Lee-Chuan Tseng, New Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 14/02 (2006.01); C23C 14/46 (2006.01); C23C 14/56 (2006.01); C23C 14/58 (2006.01); C23C 16/02 (2006.01); C23C 16/44 (2006.01); H01L 21/3065 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32633 (2013.01); C23C 14/022 (2013.01); C23C 14/46 (2013.01); C23C 14/5873 (2013.01); C23C 16/0245 (2013.01); H01J 37/32422 (2013.01); H01J 37/32431 (2013.01); H01J 37/32449 (2013.01); H01J 37/32522 (2013.01); H01J 37/32715 (2013.01); H01J 37/32834 (2013.01); H01J 37/32871 (2013.01); H01L 21/3065 (2013.01); H01L 21/31116 (2013.01); H01L 21/32136 (2013.01); H01L 21/68785 (2013.01); C23C 14/564 (2013.01); C23C 16/4412 (2013.01); H01J 2237/022 (2013.01); H01J 2237/334 (2013.01);
Abstract

In some embodiments, the present disclosure relates to an etching apparatus. The etching apparatus includes a substrate holder disposed within a processing chamber and having a workpiece reception surface configured to hold a workpiece. A lower surface of the processing chamber has a first region that is directly below the workpiece reception surface and that is configured to receive a byproduct from an etching process. A baffle extends outward from a sidewall of the processing chamber at a vertical position between the substrate holder and the lower surface of the processing chamber. The baffle covers a second region of the lower surface. A byproduct redistributor is configured to move the byproduct from the first region of the lower surface to the second region of the lower surface that is directly below the baffle.


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