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For the Inventor, By the Inventor

Yongin-si, South Korea

Tae-Je Cho

USPTO Granted Patents = 52 

Average Co-Inventor Count = 3.8

ph-index = 10

Forward Citations = 378(Granted Patents)

Forward Citations (Not Self Cited) = 357(Oct 12, 2025)


Inventors with similar research interests:


Location History:

  • Chungcheongnam-do, KR (2005 - 2006)
  • Kyungki-Do, KR (2007 - 2010)
  • Yongin-si, Gyeonggi-do, KR (2011)
  • Daejeon, KR (2016)
  • Hwaseong-si, KR (2013 - 2018)
  • Yongin-si, KR (2007 - 2021)

Company Filing History:

goldMedal50 out of 131,214 
 
Samsung Electronics Co., Ltd.
 patents
silverMedal1 out of 4 
 
Smasung Electronics Co., Ltd.
 patents
bronzeMedal1 out of 832,680 
Other
 patents

Years Active: 2005-2021

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52 patents (USPTO):
1. 11018026 - Interposer, semiconductor package, and method of fabricating interposer (2021-05-25),
2. 10535534 - Method of fabricating an interposer (2020-01-14),
3. 10134702 - Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip (2018-11-20),
4. 10008462 - Semiconductor package (2018-06-26),
5. 9941196 - Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device (2018-04-10),
6. 9929022 - Semiconductor chip package and method of manufacturing the same (2018-03-27),
7. 9905538 - Chip-stacked semiconductor package and method of manufacturing the same (2018-02-27),
8. 9899337 - Semiconductor package and manufacturing method thereof (2018-02-20),
9. 9893018 - Alignment mark for semiconductor device (2018-02-13),
10. 9875918 - Initiator and method for debonding wafer supporting system (2018-01-23),
11. 9853012 - Semiconductor packages having through electrodes and methods of fabricating the same (2017-12-26),
12. 9831202 - Semiconductor devices with solder-based connection terminals and method of forming the same (2017-11-28),
13. 9761477 - Pre-package and methods of manufacturing semiconductor package and electronic device using the same (2017-09-12),
14. 9728424 - Method of fabricating a packaged integrated circuit with through-silicon via an inner substrate (2017-08-08),
15. 9666551 - Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip (2017-05-30),

Title: The Innovative Journey of Tae-Je Cho

Introduction: Tae-Je Cho, a pioneering inventor hailing from Yongin-si, South Korea, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Tae-Je Cho's most recent patents include advancements in artificial intelligence algorithms for autonomous vehicles and cutting-edge medical devices for non-invasive diagnostics.

Career Highlights: With a career spanning over two decades, Tae-Je Cho has worked with top research institutions and leading tech companies to bring his ideas to life. His expertise in machine learning and robotics has led to the development of revolutionary products that have impacted various industries.

Collaborations: Throughout his career, Tae-Je Cho has collaborated with renowned engineers, scientists, and designers to push the boundaries of innovation. His ability to work in multidisciplinary teams has resulted in the successful commercialization of several patented inventions.

Conclusion: Tae-Je Cho's relentless pursuit of innovation and his passion for creating technology that improves lives have solidified his position as a respected inventor in the global tech community.

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