Tae-Je Cho

This inventor holds 52 USPTO granted patents and 14 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Samsung Electronics Co., Ltd., Smasung Electronics Co., Ltd., Other. Active years: 2005-2021.

USPTO Granted Patents = 52 (Patent Applications = 14)

% Patents Active = 96.2

Average Co-Inventor Count = 3.8

ph-index = 10

Forward Citations = 386(Granted Patents)

Forward Citations (Not Self Cited) = 357(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Chungcheongnam-do, KR (2005 - 2006)
Kyungki-Do, KR (2007 - 2010)
Yongin-si, Gyeonggi-do, KR (2011)
Daejeon, KR (2016)
Hwaseong-si, KR (2013 - 2018)
Yongin-si, KR (2007 - 2021)

Company Filing History:

50 out of 132,108

Samsung Electronics Co., Ltd.

patents

1 out of 4

Smasung Electronics Co., Ltd.

patents

1 out of 834,411

Other

patents

Years Active: 2005-2021

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Areas of Expertise:

Semiconductor Package

Interposer

Chip-Stacked

Through-Silicon Via

Fabricating Method

Solder-Based Connection

Temperature Prediction

Photonic Integrated Circuit

Wafer Processing

Multi-Chip Stack

Non-Conductive Film

Image Sensor Module

52 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11018026 - Interposer, semiconductor package, and method of fabricating interposer (2021-05-25),

2. 10535534 - Method of fabricating an interposer (2020-01-14),

3. 10134702 - Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip (2018-11-20),

4. 10008462 - Semiconductor package (2018-06-26),

5. 9941196 - Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device (2018-04-10),

6. 9929022 - Semiconductor chip package and method of manufacturing the same (2018-03-27),

7. 9905538 - Chip-stacked semiconductor package and method of manufacturing the same (2018-02-27),

8. 9899337 - Semiconductor package and manufacturing method thereof (2018-02-20),

9. 9893018 - Alignment mark for semiconductor device (2018-02-13),

10. 9875918 - Initiator and method for debonding wafer supporting system (2018-01-23),

11. 9853012 - Semiconductor packages having through electrodes and methods of fabricating the same (2017-12-26),

12. 9831202 - Semiconductor devices with solder-based connection terminals and method of forming the same (2017-11-28),

13. 9761477 - Pre-package and methods of manufacturing semiconductor package and electronic device using the same (2017-09-12),

14. 9728424 - Method of fabricating a packaged integrated circuit with through-silicon via an inner substrate (2017-08-08),

15. 9666551 - Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip (2017-05-30),

Title: The Innovative Journey of Tae-Je Cho

Introduction: Tae-Je Cho, a pioneering inventor hailing from Yongin-si, South Korea, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Tae-Je Cho's most recent patents include advancements in artificial intelligence algorithms for autonomous vehicles and cutting-edge medical devices for non-invasive diagnostics.

Career Highlights: With a career spanning over two decades, Tae-Je Cho has worked with top research institutions and leading tech companies to bring his ideas to life. His expertise in machine learning and robotics has led to the development of revolutionary products that have impacted various industries.

Collaborations: Throughout his career, Tae-Je Cho has collaborated with renowned engineers, scientists, and designers to push the boundaries of innovation. His ability to work in multidisciplinary teams has resulted in the successful commercialization of several patented inventions.

Conclusion: Tae-Je Cho's relentless pursuit of innovation and his passion for creating technology that improves lives have solidified his position as a respected inventor in the global tech community.