Ru-Liang Lee

This inventor holds 74 USPTO granted patents and 17 published patent applications, primarily in Semiconductor Technology (CPC class H01L). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2015-2026.

USPTO Granted Patents = 74 (Patent Applications = 17)

% Patents Active = 79.7

Average Co-Inventor Count = 5.3

ph-index = 7

Forward Citations = 232(Granted Patents)

Forward Citations (Not Self Cited) = 212(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

73 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

1 out of 465

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

Years Active: 2015-2026

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Areas of Expertise:

Silicon-On-Insulator

Wafer Bonding

Flash Memory

Epitaxial Semiconductor

High Voltage Devices

Thin Film Transfer

Multilayer Isolation

Memory Devices

Magnetic Tunnel Junction

RRAM Cell

Transistor Manufacturing

Substrate Technologies

74 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12677494 - Epitaxial semiconductor liner for enhancing uniformity of a charged layer in a deep trench and methods of forming the same (2026-07-07),

2. 12663595 - Semiconductor photonics device and methods of formation for specific photonics construction and structure (2026-06-23),

3. 12628356 - Multi-lateral recessed MIM structure (2026-05-12),

4. 12557610 - Multilayer isolation structure for high voltage silicon-on-insulator device (2026-02-17),

5. 12471379 - Multi-function substrate (2025-11-11),

6. 12369352 - Thin film transfer using substrate with etch stop layer and diffusion barrier layer (2025-07-22),

7. 12230585 - Photolithography alignment process for bonded wafers (2025-02-18),

8. 12211737 - Cleaning chamber for metal oxide removal (2025-01-28),

9. 12113071 - Multi-function substrate (2024-10-08),

10. 12040221 - Fabrication method of metal-free SOI wafer (2024-07-16),

11. 11916022 - Photolithography alignment process for bonded wafers (2024-02-27),

12. 11804531 - Thin film transfer using substrate with etch stop layer and diffusion barrier layer (2023-10-31),

13. 11735624 - Multi-lateral recessed MIM structure (2023-08-22),

14. 11721752 - Semiconductor device having doped seed layer and method of manufacturing the same (2023-08-08),

15. 11682578 - Multilayer isolation structure for high voltage silicon-on-insulator device (2023-06-20),

Title: The Innovative Journey of Ru-Liang Lee

Introduction: Ru-Liang Lee, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents: Lee's latest patents include advancements in semiconductor technology, renewable energy solutions, and artificial intelligence systems, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Ru-Liang Lee has held key positions in leading tech companies, where he spearheaded research and development projects that have resulted in numerous successful patent applications. His expertise in areas such as nanotechnology and telecommunications has earned him recognition as a pioneer in the industry.

Collaborations: Throughout his career, Lee has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge sharing. His partnerships have led to the development of cutting-edge technologies that have had a lasting impact on various sectors.

Conclusion: Ru-Liang Lee's passion for innovation, coupled with his dedication to pushing the boundaries of technology, has solidified his reputation as a visionary inventor. His relentless pursuit of excellence continues to inspire the next generation of inventors and shape the future of technological advancements.