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For the Inventor, By the Inventor

Greensboro, GA, United States of America

Rao R Tummala

This inventor holds 20 USPTO granted patents and 7 published patent applications. Top assignees: Georgia Tech Research Corporation, Medtronic, Inc., Nitto-Denko Corporation. Active years: 2001-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rao R Tummala. Retrieved from https://idiyas.com/inventor/rao-r-tummala

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 

% Patents Active = 60.0

Average Co-Inventor Count = 3.8

ph-index = 6

Forward Citations = 195(Granted Patents)


Location History:

  • Stone Mountain, GA (US) (2001 - 2012)
  • Grennsboro, GA (US) (2015)
  • Greensboro, GA (US) (2011 - 2020)
  • Atlanta, GA (US) (2016 - 2024)

Company Filing History:

goldMedal20 out of 2,193 
 
Georgia Tech Research Corporation
 patents
silverMedal1 out of 8,956 
 
Medtronic, Inc.
 patents
bronzeMedal1 out of 3,949 
 
Nitto-Denko Corporation
 patents
where one patent can have more than one assignee

Years Active: 2001-2026

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20 patents (USPTO):Explore Patents
1. 12733467 - Methods for etch barrier deposition and devices made according to the same (2026-09-08),
2. 12315787 - Embedded semiconductor packages and methods thereof (2025-05-27),
3. 12027453 - Embedded semiconductor packages and methods thereof (2024-07-02),
4. 11756985 - Substrate-compatible inductors with magnetic layers (2023-09-12),
5. 10672718 - Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same (2020-06-02),
6. 9417415 - Interposer with polymer-filled or polymer-lined optical through-vias in thin glass substrate (2016-08-16),
7. 9275934 - Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same (2016-03-01),
8. 9173282 - Interconnect structures and methods of making the same (2015-10-27),
9. 9167694 - Ultra-thin interposer assemblies with through vias (2015-10-20),
10. 8970036 - Stress relieving second level interconnect structures and methods of making the same (2015-03-03),
11. 8633601 - Interconnect assemblies and methods of making and using same (2014-01-21),
12. 8536695 - Chip-last embedded interconnect structures (2013-09-17),
13. 8335084 - Embedded actives and discrete passives in a cavity within build-up layers (2012-12-18),
14. 8174017 - Integrating three-dimensional high capacitance density structures (2012-05-08),
15. 8084841 - Systems and methods for providing high-density capacitors (2011-12-27),

Title: Inventor Rao R Tummala - Pioneering Innovations in Greensboro, GA

Introduction: Rao R Tummala is a distinguished inventor based in Greensboro, Georgia, known for his groundbreaking contributions to the field of technology and engineering.

Latest Patents: Rao R Tummala holds several patents in the areas of microelectronics, packaging, and semiconductor technologies, showcasing his continuous commitment to innovation and advancement in the industry.

Career Highlights: With a career spanning several decades, Rao R Tummala has held key positions in renowned research institutions and universities, where he has led numerous projects that have significantly impacted the field of electronics.

Collaborations: Throughout his career, Rao R Tummala has collaborated with leading companies, banks, and research institutions, fostering a culture of innovation and knowledge-sharing that has led to the development of cutting-edge technologies.

Conclusion: Inventor Rao R Tummala's relentless pursuit of innovation and his dedication to pushing the boundaries of technology have solidified his reputation as a visionary in the field of microelectronics and semiconductor packaging.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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