The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Jan. 25, 2016
Georgia Tech Research Corporation, Atlanta, GA (US);
Venkatesh Sundaram, Alpharetta, GA (US);
Fuhan Liu, Atlanta, GA (US);
Rao R. Tummala, Greensboro, GA (US);
Vijay Sukumaran, Atlanta, GA (US);
Vivek Sridharan, Atlanta, GA (US);
Qiao Chen, Atlanta, GA (US);
Georgia Tech Research Corporation, Atlanta, GA (US);
Abstract
Disclosed herein are, for instance, methods for producing through package vias in a glass interposer. For instance, disclosed herein is a method for producing through package vias in a glass interposer comprising laminating a polymer on at least a portion of a top surface of a glass interposer, removing at least a portion of the polymer and the glass interposer to form a through via, filling at least a portion of the through via with a metal conductor to form a metallization layer, and selectively removing a portion of the metallization layer to form a metalized through package via. Other methods are also disclosed, along with through-package-via structures in glass interposers produced therefrom.