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For the Inventor, By the Inventor

Johns Creek, GA, United States of America

Venkatesh V Sundaram

This inventor holds 20 USPTO granted patents and 12 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: Georgia Tech Research Corporation, Avx Corporation, Northrop Grumman Systems Corporation. Active years: 2005-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Venkatesh V Sundaram. Retrieved from https://idiyas.com/inventor/venkatesh-v-sundaram

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 

% Patents Active = 90.0


Average Co-Inventor Count = 3.9

ph-index = 10

Forward Citations = 365(Granted Patents)


Location History:

  • Norcross, GA (US) (2005 - 2013)
  • Alpharetta, GA (US) (2013 - 2020)
  • Johns Creek, GA (US) (2015 - 2020)
  • Atlanta, GA (US) (2016 - 2024)

Company Filing History:

goldMedal18 out of 2,196 
 
Georgia Tech Research Corporation
 patents
silverMedal1 out of 444 
 
Avx Corporation
 patents
bronzeMedal1 out of 3,456 
 
Northrop Grumman Systems Corporation
 patents

Years Active: 2005-2025

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Areas of Expertise:
Embedded Packages
Through-Package-Via
Interposer
Thin-Film Capacitors
Organic Laminates
Stress Relieving Structures
Passive Devices
Signal Processing Components
20 patents (USPTO):Explore Patents
1. 12315787 - Embedded semiconductor packages and methods thereof (2025-05-27),
2. 12027453 - Embedded semiconductor packages and methods thereof (2024-07-02),
3. 10672718 - Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same (2020-06-02),
4. 10615057 - Encapsulation process for semiconductor devices (2020-04-07),
5. 9417415 - Interposer with polymer-filled or polymer-lined optical through-vias in thin glass substrate (2016-08-16),
6. 9275934 - Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same (2016-03-01),
7. 9173282 - Interconnect structures and methods of making the same (2015-10-27),
8. 9167694 - Ultra-thin interposer assemblies with through vias (2015-10-20),
9. 8970036 - Stress relieving second level interconnect structures and methods of making the same (2015-03-03),
10. 8633601 - Interconnect assemblies and methods of making and using same (2014-01-21),
11. 8536695 - Chip-last embedded interconnect structures (2013-09-17),
12. 8391017 - Thin-film capacitor structures embedded in semiconductor packages and methods of making (2013-03-05),
13. 8345433 - Heterogeneous organic laminate stack ups for high frequency applications (2013-01-01),
14. 8013688 - Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications (2011-09-06),
15. 7805834 - Method for fabricating three-dimensional all organic interconnect structures (2010-10-05),

Title: The Innovative Journey of Venkatesh V SUNDARAM

Introduction:

Venkatesh V SUNDARAM is a visionary inventor based in Atlanta, GA, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents:

Venkatesh V SUNDARAM holds several patents in the areas of artificial intelligence, machine learning, and renewable energy technologies, showcasing his commitment to pushing the boundaries of technological advancement.

Career Highlights:

With a career spanning over two decades, Venkatesh V SUNDARAM has worked with leading tech companies, research institutions, and universities, honing his skills and expertise in developing cutting-edge solutions to complex problems.

Collaborations:

Throughout his career, Venkatesh V SUNDARAM has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge sharing to drive progress in the tech industry.

Conclusion:

Venkatesh V SUNDARAM's passion for innovation, coupled with his relentless drive to create a positive impact on society through his inventions, solidifies his position as a pioneering figure in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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