The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2014
Filed:
Jul. 13, 2010
Nitesh Kumbhat, Atlanta, GA (US);
Abhishek Choudhury, Atlanta, GA (US);
Venkatesh V. Sundaram, Alpharetta, GA (US);
Rao R. Tummala, Greensboro, GA (US);
Nitesh Kumbhat, Atlanta, GA (US);
Abhishek Choudhury, Atlanta, GA (US);
Venkatesh V. Sundaram, Alpharetta, GA (US);
Rao R. Tummala, Greensboro, GA (US);
Georgia Tech Research Corporation, Atlanta, GA (US);
Abstract
The various embodiments of the present invention provide fine pitch, chip-to-substrate interconnect assemblies, as well as methods of making and using the assemblies. The assemblies generally include a semiconductor having a die pad and a bump disposed thereon and a substrate having a substrate pad disposed thereon. The bump is configured to electrically interconnect at least a portion of the semiconductor with at least a portion of the substrate when the bump is contacted with the substrate pad. In addition, when the bump is contacted to the substrate pad, at least a portion of the bump and at least a portion of the substrate pad are deformed so as to create a non-metallurgical bond therebetween.