Abhishek Choudhury

Title: Abhishek Choudhury: Innovator in Interconnect Assemblies

Introduction

Abhishek Choudhury is a notable inventor based in Atlanta, GA (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of interconnect assemblies. His innovative work has led to the development of a patent that enhances the efficiency of chip-to-substrate connections.

Latest Patents

Abhishek holds a patent for "Interconnect assemblies and methods of making and using same." This invention provides fine pitch, chip-to-substrate interconnect assemblies, along with methods for their creation and application. The assemblies include a semiconductor with a die pad and a bump, as well as a substrate featuring a substrate pad. The bump is designed to electrically connect the semiconductor to the substrate when it makes contact with the substrate pad. Notably, this contact results in the deformation of both the bump and the substrate pad, creating a non-metallurgical bond between them. Abhishek has 1 patent to his name.

Career Highlights

Abhishek Choudhury is affiliated with the Georgia Tech Research Corporation, where he continues to push the boundaries of innovation in semiconductor technology. His work is characterized by a commitment to advancing the methods and materials used in electronic interconnections.

Collaborations

Abhishek collaborates with talented individuals such as Nitesh Kumbhat and Venkatesh V Sundaram. Their combined expertise fosters a dynamic environment for innovation and research.

Conclusion

Abhishek Choudhury is a prominent figure in the field of interconnect assemblies, with a focus on enhancing semiconductor technology. His contributions are paving the way for future advancements in the industry.