Vivek Sridharan

Title: Innovations of Vivek Sridharan

Introduction

Vivek Sridharan is an accomplished inventor based in Atlanta, GA. He has made significant contributions to the field of microelectronics, particularly through his innovative patents. With a total of two patents to his name, he continues to push the boundaries of technology.

Latest Patents

Vivek's latest patents include "Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same." This patent discloses methods for producing through package vias in a glass interposer. The process involves laminating a polymer on a portion of the top surface of a glass interposer, removing portions of the polymer and glass to form a through via, and filling it with a metal conductor to create a metallization layer. Another aspect of his patent relates to a microelectronic package that includes a plurality of through vias in a glass interposer, featuring a stress relief barrier and a metallization seed layer.

Career Highlights

Vivek Sridharan is currently associated with the Georgia Tech Research Corporation, where he applies his expertise in microelectronics. His work has been instrumental in advancing the technology surrounding through-package-via structures.

Collaborations

Some of Vivek's notable coworkers include Venkatesh V Sundaram and Fuhan Liu, who contribute to the innovative environment at Georgia Tech Research Corporation.

Conclusion

Vivek Sridharan's contributions to microelectronics through his patents demonstrate his commitment to innovation and technology advancement. His work continues to influence the field significantly.