Fuhan Liu

Title: Fuhan Liu: Innovator in Microelectronic Packaging

Introduction

Fuhan Liu is a prominent inventor based in Atlanta, GA, known for his significant contributions to the field of microelectronics. With a total of four patents to his name, Liu has made strides in developing advanced technologies that enhance the performance and reliability of electronic devices.

Latest Patents

Liu's latest patents include innovative methods for producing through-package-via (TPV) structures on inorganic interposers. One of his notable patents discloses methods for fabricating through package vias in a glass interposer. This method involves laminating a polymer on the top surface of a glass interposer, removing portions of the polymer and glass to create a through via, and filling it with a metal conductor to form a metallization layer. Another patent focuses on microelectronic packages that incorporate a plurality of through vias in a glass interposer, featuring stress relief barriers and metallization seed layers to improve functionality.

Career Highlights

Fuhan Liu is affiliated with the Georgia Tech Research Corporation, where he continues to push the boundaries of microelectronic packaging technology. His work has been instrumental in advancing the capabilities of electronic components, making them more efficient and reliable.

Collaborations

Liu collaborates with esteemed colleagues such as Venkatesh V Sundaram and Rao R Tummala, who share his passion for innovation in the field of microelectronics.

Conclusion

Fuhan Liu's contributions to microelectronic packaging through his innovative patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence the development of advanced electronic technologies.