Vijay Sukumaran

Title: Innovations of Vijay Sukumaran

Introduction

Vijay Sukumaran is an accomplished inventor based in Atlanta, GA. He has made significant contributions to the field of microelectronics, particularly through his innovative patents. With a total of two patents to his name, Sukumaran's work focuses on advanced structures and methods in the realm of interposers.

Latest Patents

Sukumaran's latest patents include "Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same." This patent discloses methods for producing through package vias in a glass interposer. The process involves laminating a polymer on a portion of the top surface of a glass interposer, removing portions of the polymer and glass to form a through via, and filling the via with a metal conductor to create a metallization layer. Another patent under his name also relates to TPV structures, detailing a microelectronic package that includes a plurality of through vias in a glass interposer, along with a stress relief barrier and metallization seed layer.

Career Highlights

Vijay Sukumaran is associated with the Georgia Tech Research Corporation, where he continues to push the boundaries of microelectronic packaging technology. His work has garnered attention for its innovative approach to enhancing the performance and reliability of electronic devices.

Collaborations

Sukumaran has collaborated with notable colleagues, including Venkatesh V Sundaram and Fuhan Liu, contributing to a dynamic research environment that fosters innovation.

Conclusion

Vijay Sukumaran's contributions to the field of microelectronics through his patents and research at Georgia Tech Research Corporation highlight his role as a leading inventor in the industry. His work continues to influence advancements in technology and microelectronic packaging.