The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2011

Filed:

May. 05, 2009
Applicants:

Markondeyaraj Pulugurtha, Tucker, GA (US);

Andreas Fenner, Chandler, AZ (US);

Anna Malin, Phoenix, AZ (US);

Dasharatham Janagama Goud, Tucker, GA (US);

Rao Tummala, Greensboro, GA (US);

Inventors:

MarkondeyaRaj Pulugurtha, Tucker, GA (US);

Andreas Fenner, Chandler, AZ (US);

Anna Malin, Phoenix, AZ (US);

Dasharatham Janagama Goud, Tucker, GA (US);

Rao Tummala, Greensboro, GA (US);

Assignees:

Georgia Tech Research, Atlanta, GA (US);

Medtronic, Inc., Minneapolis, MN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01G 4/005 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention describes systems and methods for providing high-density capacitors. An exemplary embodiment of the present invention provides a high-density capacitor system comprising a substrate and a porous conductive layer formed on the substrate, wherein the porous conductive layer is formed in accordance with a predetermined pattern. Furthermore, the high-density capacitor system includes a dielectric material formed on the porous conductive layer and a second conductive layer formed on the dielectric material. Additionally, the high-density capacitor system includes a plurality of conductive pads configured in communication with the second conductive layer.


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