IDiyas

For the Inventor, By the Inventor

Irving, TX, United States of America

Rajiv Carl Dunne

USPTO Granted Patents = 18 

Average Co-Inventor Count = 2.8

ph-index = 8

Forward Citations = 135(Granted Patents)


Location History:

  • Irving, TX (US) (2006 - 2009)
  • Murphy, TX (US) (2009 - 2015)
  • San Diego, CA (US) (2015 - 2016)

Company Filing History:

goldMedal18 out of 29,232 
 
Texas Instruments Corporation
 patents

Years Active: 2006-2016

where 'Filed Patents' based on already Granted Patents

18 patents (USPTO):
1. 9373572 - Semiconductor package having etched foil capacitor integrated into leadframe (2016-06-21),
2. 9165873 - Semiconductor package having etched foil capacitor integrated into leadframe (2015-10-20),
3. 9142496 - Semiconductor package having etched foil capacitor integrated into leadframe (2015-09-22),
4. 9030216 - Coaxial four-point probe for low resistance measurements (2015-05-12),
5. 8883567 - Process of making a stacked semiconductor package having a clip (2014-11-11),
6. 8436475 - IC device having low resistance TSV comprising ground connection (2013-05-07),
7. 8431481 - IC device having low resistance TSV comprising ground connection (2013-04-30),
8. 8313982 - Stacked die assemblies including TSV die (2012-11-20),
9. 8178976 - IC device having low resistance TSV comprising ground connection (2012-05-15),
10. 8174276 - Coaxial four-point probe for low resistance measurements (2012-05-08),
11. 8154134 - Packaged electronic devices with face-up die having TSV connection to leads and die pad (2012-04-10),
12. 8017439 - Dual carrier for joining IC die or wafers to TSV wafers (2011-09-13),
13. 7915080 - Bonding IC die to TSV wafers (2011-03-29),
14. 7898069 - Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate (2011-03-01),
15. 7790597 - Solder cap application process on copper bump using solder powder film (2010-09-07),

Title: The Innovative Journey of Rajiv Carl Dunne

Introduction:

Rajiv Carl Dunne, a visionary inventor based in Irving, Texas, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents:

Rajiv Carl Dunne's latest patents include a cutting-edge artificial intelligence algorithm for predictive analytics in healthcare, a revolutionary renewable energy storage system, and a novel cybersecurity solution for IoT devices.

Career Highlights:

With a background in computer science and engineering, Rajiv Carl Dunne has a successful track record of developing innovative solutions. He has worked for leading tech companies, where he spearheaded research and development projects that have resulted in multiple patents.

Collaborations:

Throughout his career, Rajiv Carl Dunne has collaborated with top researchers, engineers, and scientists in the industry. His ability to work in multidisciplinary teams has led to the successful implementation of complex technological solutions.

Conclusion:

In conclusion, Rajiv Carl Dunne's passion for innovation and his dedication to pushing the boundaries of technology have established him as a prominent figure in the world of inventors. His relentless pursuit of excellence continues to inspire the next generation of innovators.

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