Rajiv Carl Dunne

This inventor holds 18 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignee: Texas Instruments Corporation. Active years: 2006-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rajiv Carl Dunne. Retrieved from https://idiyas.com/inventor/rajiv-carl-dunne

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 (Patent Applications = 1)

% Patents Active = 100.0

Average Co-Inventor Count = 2.8

ph-index = 8

Forward Citations = 139(Granted Patents)

Location History:

Irving, TX (US) (2006 - 2009)
Murphy, TX (US) (2009 - 2015)
San Diego, CA (US) (2015 - 2016)

Company Filing History:

18 out of 29,901

Texas Instruments Corporation

patents

Years Active: 2006-2016

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Areas of Expertise:

Etched Foil Capacitor

Low Resistance TSV

Stacked Die Assemblies

Coaxial Probe

IC Device

Thermal Management

Solder Cap Application

Hybrid Substrate

Semiconductor Package

Thermal Interface

Bonding Process

Wafers

18 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9373572 - Semiconductor package having etched foil capacitor integrated into leadframe (2016-06-21),

2. 9165873 - Semiconductor package having etched foil capacitor integrated into leadframe (2015-10-20),

3. 9142496 - Semiconductor package having etched foil capacitor integrated into leadframe (2015-09-22),

4. 9030216 - Coaxial four-point probe for low resistance measurements (2015-05-12),

5. 8883567 - Process of making a stacked semiconductor package having a clip (2014-11-11),

6. 8436475 - IC device having low resistance TSV comprising ground connection (2013-05-07),

7. 8431481 - IC device having low resistance TSV comprising ground connection (2013-04-30),

8. 8313982 - Stacked die assemblies including TSV die (2012-11-20),

9. 8178976 - IC device having low resistance TSV comprising ground connection (2012-05-15),

10. 8174276 - Coaxial four-point probe for low resistance measurements (2012-05-08),

11. 8154134 - Packaged electronic devices with face-up die having TSV connection to leads and die pad (2012-04-10),

12. 8017439 - Dual carrier for joining IC die or wafers to TSV wafers (2011-09-13),

13. 7915080 - Bonding IC die to TSV wafers (2011-03-29),

14. 7898069 - Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate (2011-03-01),

15. 7790597 - Solder cap application process on copper bump using solder powder film (2010-09-07),

Title: The Innovative Journey of Rajiv Carl Dunne

Introduction:

Rajiv Carl Dunne, a visionary inventor based in Irving, Texas, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents:

Rajiv Carl Dunne's latest patents include a cutting-edge artificial intelligence algorithm for predictive analytics in healthcare, a revolutionary renewable energy storage system, and a novel cybersecurity solution for IoT devices.

Career Highlights:

With a background in computer science and engineering, Rajiv Carl Dunne has a successful track record of developing innovative solutions. He has worked for leading tech companies, where he spearheaded research and development projects that have resulted in multiple patents.

Collaborations:

Throughout his career, Rajiv Carl Dunne has collaborated with top researchers, engineers, and scientists in the industry. His ability to work in multidisciplinary teams has led to the successful implementation of complex technological solutions.

Conclusion:

In conclusion, Rajiv Carl Dunne's passion for innovation and his dedication to pushing the boundaries of technology have established him as a prominent figure in the world of inventors. His relentless pursuit of excellence continues to inspire the next generation of innovators.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: