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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9373572 B1

PDFFull Text
Date of Patent:
Jun. 21, 2016

Filed:

Oct. 09, 2015

Semiconductor package having etched foil capacitor integrated into leadframe

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Gregory E. Howard, Plano, TX (US);

Bernardo Gallegos, McKinney, TX (US);

Rajiv Dunne, San Diego, CA (US);

Darvin R. Edwards, Garland, TX (US);

Siva P. Gurrum, Allen, TX (US);

Manu J. Prakuzhy, Allen, TX (US);

Donald C. Abbott, Chartley, MA (US);

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorneys:

Steven A. Shaw

Frank D. Cimino

Primary Examiner:

Jami M Valentine

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/495 (2006.01); H01L 21/78 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49589 (2013.01); H01L 21/4821 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/3107 (2013.01); H01L 23/3114 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/49582 (2013.01); H01L 24/49 (2013.01); H01L 24/97 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1776 (2013.01); H01L 2924/17724 (2013.01); H01L 2924/17747 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01);
Abstract

A packaged semiconductor device including a leadframe and a plurality of angularly shaped capacitors. The leadframe includes structures with surfaces and sidewalls. The angularly shaped capacitors are attached to surface portions of the leadframe structures. The angularly shaped capacitors have sidewalls coplanar with structure sidewalls. The angularly shaped capacitors includes a conductive material attached to the structure surface. The conductive material having pores covered by oxide and filled with conductive polymer. The angularly shaped capacitors topped by electrodes are made of a second metal.

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